WMSIC Electronic Components

Chipanalog CA-IS3720LG

ModelCA-IS3720LG
PackageSOIC8-WB(G)
BrandChipanalog
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Chipanalog CA-IS3720LG
Type
CHIPANALOG
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHIPANALOG
Electronic Component
CA-IS3720LG
Electronic Component
1
Package
SOIC8-WB(G)
Electronic Component
Isolated
Electronic Component
0.955g
Electronic Component
1
CMTI(kV/us)
150kV/us
Features
Output
Electronic Component
BM0228731304
Operating Temperature
40℃~+125℃
Output
Level
Channel Count
0
Channel Count
2
(tpd)
12ns

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CA-IS3720LG — 双通道数字隔离器产品概述

一、产品简介

CA-IS3720LG 是川土微(Chipanalog)推出的一款高性能双通道数字隔离器,采用 SOIC8-WB(G) 封装,提供两个正向(A→B)隔离数据通道,反向通道数为 0。器件默认输出为低电平,隔离电压达 5000 Vrms,适用于对安全性、抗干扰能力和高速数据传输有较高要求的系统。

二、主要参数

  • 最大数据速率:150 Mbps(每通道)
  • 传播延迟(tpd):约 12 ns
  • 工作电压:VCCA = 2.5 V ~ 5.5 V,VCCB = 2.5 V ~ 5.5 V(两侧电源独立)
  • 隔离电压(Vrms):5000 V
  • CMTI(共模瞬态抗扰度):150 kV/µs
  • 默认输出状态:低电平(failsafe)
  • 工作温度范围:-40 °C ~ +125 °C
  • 封装:SOIC8-WB(G)

三、功能与优势

  • 高速:支持最高 150 Mbps 的数字信号传输,传播延迟仅 12 ns,适合 SPI、UART、并行数字信号等高速接口。
  • 高隔离和强抗扰:5000 Vrms 隔离等级结合 150 kV/µs 的 CMTI,适用于电力电子、逆变器、电机驱动等有大共模瞬变的场合。
  • 宽电源兼容性:VCCA/VCCB 支持 2.5 V 至 5.5 V,便于不同电平域的直接互联与电平移位。
  • 可靠的默认状态:当任一侧电源缺失或上电不稳定时,器件输出为低电平,提高系统确定性与安全性。
  • 小尺寸封装:SOIC8-WB(G) 便于 PCB 布局和批量生产。

四、典型应用场景

  • 工业控制与自动化:PLC、现场总线隔离、传感器采集模块。
  • 电力与电机驱动:逆变器、功率级驱动信号隔离,抗干扰要求高的电力电子系统。
  • 数据采集与转换:隔离的 ADC/DAC 接口、通信隔离。
  • 安全隔离场合:需要高耐压隔离的电源管理和测量系统(按系统认证要求选型与验证)。

五、设计与使用建议

  • 电源去耦:在 VCCA、VCCB 引脚附近各放置 0.1 µF 陶瓷去耦电容,并辅以 1 µF~10 µF 的旁路电容以抑制低频噪声。
  • PCB 布局:保持隔离区清晰的爬电距离和气隙,关键走线远离高 dv/dt 节点;敏感信号走短线并做差分或屏蔽处理。
  • 参考数据手册:封装引脚排列、最大额定值、上电/断电顺序与 ESD 保护要求请以器件数据手册为准。
  • 热管理:在高频工作或高温环境下关注功耗与散热,必要时增大铜厚或使用散热面。

六、封装与采购信息

  • 品牌:Chipanalog(川土微)
  • 型号:CA-IS3720LG
  • 封装:SOIC8-WB(G)
  • 采购与替代:可作为光耦隔离器的高速替代方案,具体替代需比较传播延迟、隔离等级与 CMTI 指标,选型前请确认系统兼容性。

如需进一步的电气特性曲线、典型应用电路或 PCB 布局示意,请提供联系方式或索取器件数据手册型号,本概述旨在帮助快速理解 CA-IS3720LG 的主要性能与应用方向。

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