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Chipanalog CS817X22HS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Chipanalog CS817X22HS
- Type
- CHIPANALOG
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CHIPANALOG
- Electronic Component
- CS817X22HS
- Electronic Component
- 1
- Package
- SOIC8(S)
- Electronic Component
- Isolated
- Electronic Component
- 0.36g
- Electronic Component
- 1
- CMTI(kV/us)
- 150kV/us
- Features
- Voltage Interface; Output
- Electronic Component
- BM0225175782
- Operating Temperature
- 40℃~+105℃
- Output
- Level
- Channel Count
- 1
- Channel Count
- 1
- (tpd)
- 2us
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CS817X22HS 产品概述
一、产品简介
CS817X22HS 是 Chipanalog（川土微）推出的一款低功耗数字隔离器，针对工业、仪表和汽车电子等需要不同电位域之间安全、稳定数据传输的场合设计。器件提供一对互向隔离通道（正向1路、反向1路），支持多电压域接口，具有失效安全输出（默认高电平），并在紧凑的 SOIC8 封装中实现高达 3000 Vrms 的隔离强度。
二、主要特性
- 最大数据速率：200 kbps，适合低速串行通信与控制信号隔离。
- 失效安全：默认输出为高电平，输入异常或电源问题时输出处于定义态，便于系统上电与故障诊断。
- 多电压域接口：VCCA 与 VCCB 可独立供电，工作电压范围均为 2.375 V ~ 5.5 V，方便在 2.5V/3.3V/5V 系统间直连。
- 高共模瞬态抗扰度（CMTI）：150 kV/μs，适应噪声环境下的稳定通信。
- 低功耗设计，适合对能耗敏感的嵌入式应用。
三、电气与性能要点
- 隔离电压（Vrms）：3000 V，有效阻断高电位差导致的漏电与干扰。
- 传播延迟（tpd）：典型 2 μs，适用于对确定性延迟要求不高的控制与通信链路。
- 工作温度范围：-40 ℃ ~ +105 ℃，满足工业级温度要求。
- 封装：SOIC8(S)，便于常规 PCB 组装与散热布局。
四、典型应用场景
- 串口隔离（UART/调试口）与低速串行链路隔离。
- 工业现场控制信号隔离、PLC 与传感器间数据隔离。
- 电源管理与隔离监测（例如开关电源反馈隔离）。
- 消除地环路、提高系统抗干扰能力的各类嵌入式与通讯设备。
五、使用建议与注意事项
- 电源与地：VCCA 与 VCCB 必须分别由各自侧电源供电，两侧地不得直接连通；在各电源引脚附近放置 0.1 μF 旁路电容以抑制瞬态噪声。
- 布局与绝缘：为保证隔离耐压与长期可靠性，应满足 PCB 的爬电距离与气隙要求，并避免在隔离沟道上布置敏感元件。
- 噪声与 CMTI：在高共模干扰环境中，设计时需考虑走线屏蔽与滤波，充分利用器件高达 150 kV/μs 的抗扰能力。
- 速率与延迟匹配：器件适用于最高 200 kbps 的低速通信，若系统对延迟或速率有更高要求，应评估是否需要高速隔离器。
总结：CS817X22HS 将可靠的高压隔离、低功耗与多电压域兼容性集于一体，是解决低速数据与控制信号隔离问题的实用选择，尤其适合工业与嵌入式场合中对失效安全与共模抗扰力要求较高的应用。
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