WMSIC Electronic Components

Chipanalog CA-IS3722CHS

ModelCA-IS3722CHS
PackageSOIC-8
BrandChipanalog
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Chipanalog CA-IS3722CHS
Type
CHIPANALOG
Minimum package
2500 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHIPANALOG
Electronic Component
CA-IS3722CHS
Electronic Component
1
Package
SOIC-8
Electronic Component
Isolated
Electronic Component
0.363g
Electronic Component
1
CMTI(kV/us)
150kV/us
Features
Output
Electronic Component
BM0227776255
Operating Temperature
40℃~+125℃
Output
Level
Channel Count
1
Channel Count
1
(tpd)
22ns

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CA-IS3722CHS 产品概述

一、产品简介

CA-IS3722CHS 是川土微(Chipanalog)推出的一款隔离型数字光耦替代器/隔离数字收发器,适用于工业现场与控制侧之间的数字信号隔离。器件采用 SOIC-8 封装,提供电气隔离和高抗干扰能力,适配 3V 至 5.5V 的逻辑电平,工作温度范围宽 (-40℃ 至 +125℃),满足严苛工业环境的可靠性要求。

二、主要参数

  • 最大数据速率:40 Mbps
  • 通道配置:1 路正向通道 + 1 路反向通道(支持双向数据传输)
  • 默认输出电平:高电平(器件上电或输入失效时输出为高)
  • 隔离电压(Vrms):3750 Vrms
  • 共模瞬态抗扰度(CMTI):150 kV/µs
  • 传播延迟(tpd):典型 22 ns
  • 电源电压:VCCA 3.0V ~ 5.5V,VCCB 3.0V ~ 5.5V(两侧独立供电)
  • 工作温度:-40℃ ~ +125℃
  • 封装:SOIC-8
  • 品牌:Chipanalog(川土微)

三、主要特性与优势

  • 宽工作电压范围(3.0V–5.5V),对 3.3V 与 5V 系统均兼容,系统迁移方便;
  • 双侧独立供电,便于直接连接不同电位或不同逻辑域的器件;
  • 3750 Vrms 的隔离能力与 150 kV/µs 的高 CMTI 提供突出的抗共模干扰与安全隔离能力,适合电力电子与电机驱动等高干扰场合;
  • 22 ns 的低传播延迟与 40 Mbps 的最大数据速率,兼顾速度与确定性,适合需要实时性的控制与点对点通信;
  • 默认输出为高电平,有利于总线空闲态管理与失效安全设计;
  • 工业级温度范围与 SOIC-8 小封装,有利于空间受限的板级集成。

四、典型应用场景

  • 工业控制器与现场 I/O 之间的信号隔离;
  • 电机控制与驱动器的反馈/命令隔离通道;
  • 开关电源(SMPS)控制侧与功率侧的数字隔离;
  • PLC、DCS 系统的通信隔离;
  • 需要高共模抑制的传感器信号隔离与现场总线接口。

五、设计与使用注意事项

  • 电源去耦:VCCA 与 VCCB 侧均应靠近芯片引脚放置 0.1 µF 陶瓷去耦电容,必要时并联 1 µF 低频电容以稳定低频纹波;
  • PCB 布局:保持隔离气隙和爬电距离,隔离区保持清洁以免降低耐压;将两侧接地分区处理,避免在隔离跨区布置敏感信号线;
  • 上拉/下拉:根据默认输出高特性和系统总线需求选择合适上拉阻值,避免在高干扰环境下误触发;
  • 抗干扰:虽然 CMTI 性能优异,但在高 dv/dt 场合仍建议配合滤波和共模抑制措施(如共模电感、RC 滤波);
  • 温度与功耗:在高温或高频条件下注意功耗与散热,合理评估芯片工作点与长期可靠性。

六、封装与可靠性

CA-IS3722CHS 提供 SOIC-8 封装,便于常规 PCB 贴装与自动化焊接。额定隔离电压 3750 Vrms 与工业级工作温度保证了长期运行稳定性,适合对安全隔离和电磁兼容有较高要求的应用。对于项目选型,可结合系统所需隔离等级、数据速率及 dv/dt 环境综合评估该器件的适用性。

如需更详细的电气特性曲线、引脚定义或参考电路图,请提供单位要求或索取完整数据手册。

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