WMSIC Electronic Components

Chipanalog CA-IF1021S-Q1

ModelCA-IF1021S-Q1
PackageSOIC-8-150mil
BrandChipanalog
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Chipanalog CA-IF1021S-Q1
Type
CHIPANALOG
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHIPANALOG
Electronic Component
CA-IF1021S-Q1
Electronic Component
1
Package
SOIC-8-150mil
Type
Transceiver
Electronic Component
LIN Transceiver
Electronic Component
0.186g
Electronic Component
1
Electronic Component
BM0227687127
Operating Temperature
40℃~+150℃
Operating Voltage
5.5V~27V
Operating Current
2mA
Receiver
1
Data
20Kbps
Static Current
1mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CA-IF1021S-Q1 产品概述

一、产品简介

CA-IF1021S-Q1 是川土微(Chipanalog)推出的一款车用本地互联网络(LIN)收发器,面向车载低速串行通信的物理层需求。器件通过 MCU 的 TXD 引脚控制 LIN 总线状态,并通过开漏 RXD 引脚向主控报告总线电平与通信状态。内部对驱动波形实施最佳压摆率与波形整形,以尽量降低电磁干扰(EMI),同时支持低功耗睡眠模式,满足汽车电子对可靠性与能耗的严格要求。

二、主要特点

  • 类型:LIN 收发器(收发一体)
  • 驱动器/接收器:1 驱动 / 1 接收
  • 宽工作电压:5.5 V ~ 27 V,兼容 12 V 汽车系统
  • 数据速率:最高 20 kbps(LIN 标准低速通信)
  • 工作温度:-40 ℃ ~ +150 ℃,满足车规等级温度范围
  • 工作电流:典型 2 mA;静态(睡眠)电流约 1 mA
  • 静电保护:对总线端口 ±4 kV(人体模型)
  • 输出特点:TXD 控制驱动波形,RXD 为开漏输出以报告总线状态
  • 封装:SOIC-8(150 mil)
  • 汽车级 Q1 认证定位,适合车载应用环境

三、电气与典型性能参数

  • 供电范围:5.5 V ~ 27 V,支持大范围瞬态与系统差异
  • 通信速率:20 kbps(适配 LIN 协议时序与帧结构)
  • 功耗:工作模式下约 2 mA,睡眠/静态模式下约 1 mA(典型值)
  • 耐温能力:-40 ℃ ~ +150 ℃,适应发动机舱等苛刻环境
  • ESD 抗扰度:总线端口 ±4 kV(HBM)
    这些参数保证器件在车载环境中具备稳定通讯能力与抗干扰性能。

四、典型应用场景

  • 车门控制单元(门锁、窗升降)
  • 座椅/后视镜位置控制与记忆功能
  • 室内照明、车内环境控制系统(HVAC)
  • 灯光控制模块、门把手等低速外设节点
  • LIN 与 CAN 网关、车身电子分布式节点
    适用于任何基于 LIN 协议的低速车载子系统与传感/执行器节点。

五、使用建议与注意事项

  • 电源旁路:在 VCC 端靠近器件放置陶瓷电容与去耦电容以抑制瞬态噪声。
  • 总线保护:在高噪声或易遭受浪涌的环境下,建议在 LIN 总线上配合 TVS 或其他瞬态抑制元件。
  • 布线与终端:遵循 LIN 网络拓扑规范,合理布线、减少耦合路径,必要时按系统要求配置拉电阻或终端器件。
  • 接口兼容:RXD 为开漏输出,需与上层 MCU 的 UART 接口配合相应上拉或输入配置;TXD 驱动时序应遵循 LIN 协议节拍。
  • 热与封装:SOIC-8 封装需考虑 PCB 散热与焊盘设计,保证长期可靠性。

六、封装与采购信息

  • 品牌:Chipanalog(川土微)
  • 型号:CA-IF1021S-Q1(车规级 Q1)
  • 封装:SOIC-8(150 mil)
    欲了解样品、批量供货或器件详细数据手册,请联系川土微授权代理或销售代表获取最新技术资料与应用参考电路。

七、优势总结

CA-IF1021S-Q1 以宽电压范围、车辆级温漂、低功耗睡眠与优化的压摆率控制为核心优势,兼顾 EMI 抑制与总线可靠性,适合车身电子与其它基于 LIN 的分布式控制节点,能够为汽车电子系统提供稳健、低噪声的物理层解决方案。

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