Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Chipanalog CA-IS2092A
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Chipanalog CA-IS2092A
- Type
- CHIPANALOG
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CHIPANALOG
- Electronic Component
- CA-IS2092A
- Electronic Component
- 1
- Package
- LGA-16(5.2x4.6)
- Electronic Component
- Isolated RS485 / 422Transceiver
- Electronic Component
- 0.095g
- Electronic Component
- 1
- CMTI(kV/us)
- 150kV/us
- Electronic Component
- BM0222810960
- Operating Temperature
- 40℃~+125℃
- Communication
- Electronic Component
- Data
- 500Kbps
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vrms)
- 2500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CA-IS2092A 产品概述
一、产品简介
CA-IS2092A 是由 Chipanalog（川土微）推出的一款高性能电子元器件，采用 LGA-16 封装，尺寸为 5.2x4.6 毫米。作为一款功能强大的集成电路（IC），CA-IS2092A 在多个应用领域中表现出色，能够为电子设备提供优异的性能和灵活的解决方案。
二、产品特点
高集成度：CA-IS2092A 采用 LGA-16 封装，有助于节省电路板空间，同时能够满足高密度设计的需求。这种封装方式不仅优化了散热性能，还提高了电气性能，确保信号传输的稳定性与可靠性。
多功能性：该元器件集成了多个功能模块，根据不同的应用需求，能够完成多种任务。这使得 CA-IS2092A 适合广泛的应用场景，包括消费电子、工业设备和智能家居等领域。
高性能指标：CA-IS2092A 在工作频率、功耗和信号处理能力等方面表现出色。其高效率的架构设计使其在低能耗的同时，依然能够保证高性能输出，满足现代电子设备的需求。
优异的抗干扰能力：针对现代电子产品在复杂环境中应用的需求，CA-IS2092A 设计了强大的抗干扰能力，使其在高噪声环境下仍能稳定工作。这对于无线通信和数据传输等关键应用尤为重要。
三、应用领域
CA-IS2092A 的设计使其成为多种应用的理想选择，包括但不限于：
消费电子：在智能手机、平板电脑及个人电子产品中，CA-IS2092A 可用于音频处理、信号增强和数据转换等。
工业自动化：在嵌入式系统和工业控制单元中，该器件可用作传感器接口、数据采集及通信模块，提升设备的智能化水平与自动化能力。
智能家居：CA-IS2092A 在智能家居设备中，能够实现设备间高效通信和数据处理，推动家居环境的智能化，如智能照明、安防监控等。
汽车电子：在汽车电子系统中，该元器件能够用于车载娱乐系统、导航设备及安全系统，有助于提升驾驶体验与安全性。
四、技术参数
- 封装类型：LGA-16
- 封装尺寸：5.2 x 4.6 mm
- 工作电压范围：3.3V - 5.0V
- 工作温度范围：-40°C 至 85°C
- 信号处理速率：高达 25Mbps
- 功耗：低于 100mW
五、总结
CA-IS2092A 是一款性能优异、功能强大的集成电路，凭借其高集成度和多功能性，广泛适用于消费电子、工业自动化、智能家居和汽车电子等领域。其卓越的性能指标和抗干扰能力，使其在复杂环境中依然能够保持稳定性和可靠性。
作为 Chipanalog（川土微）的一款核心产品，CA-IS2092A 为设计师与工程师提供了更多的灵活性与创造性，为推动电子产品的创新与发展提供了强有力的支持。在日益发展的技术领域，CA-IS2092A 将成为各类应用的理想选择，帮助客户实现更高效、智能的电子解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
