WMSIC Electronic Components

Chipanalog CA-IS3731HN

ModelCA-IS3731HN
PackageSOIC-16
BrandChipanalog
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Chipanalog CA-IS3731HN
Type
CHIPANALOG
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHIPANALOG
Electronic Component
CA-IS3731HN
Electronic Component
1
Package
SOIC-16
Electronic Component
Isolated
Electronic Component
0.312g
Electronic Component
1
CMTI(kV/us)
100kV/us
Features
Output
Electronic Component
BM0229934498
Operating Temperature
40℃~+125℃
Output
Level
Channel Count
1
Channel Count
2
(tpd)
8ns

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CA-IS3731HN 产品概述

一、产品简介

CA-IS3731HN 是 Chipanalog(川土微)推出的一款高速数字隔离器,SOIC-16 封装,提供双向隔离通道配置(正向通道数:2,反向通道数:1)。器件在两侧电源范围宽,VCCA/VCCB 均为 2.5V–5.5V,可直接驱动 2.5V、3.3V 和 5V 逻辑电平,适用于多种数字接口隔离与电位差分离场合。

二、主要性能指标

  • 最大数据速率:150 Mbps(每通道),支持高速串行与并行数字信号传输。
  • 传播延迟(tpd):8 ns,延时低,有利于同步总线与实时控制应用。
  • 默认输出:高电平(fail‑safe 高),在失电或输入悬空时能保证定义的安全状态。
  • 隔离电压(Vrms):5000 Vrms,满足严苛的基本/加强绝缘需求。
  • 共模瞬变耐受(CMTI):100 kV/µs,抗干扰能力强,适合噪声环境。
  • 工作温度:-40℃ ~ +125℃,适用于工业级温度范围。
  • 封装:SOIC-16,便于 PCB 布局与规模化生产。

三、设计与使用要点

  • 电源与去耦:建议在 VCCA 和 VCCB 侧各自靠近器件引脚布置高频去耦(如 0.1µF)并配合 1µF 旁路电容,以保持稳定电源并抑制瞬变。
  • 电源顺序与默认状态:器件默认输出为高电平,系统设计时需注意上电顺序与外部负载对“高”状态的接受性,必要时在输入/输出侧增加上/下拉电阻以定义确定的上电态。
  • PCB 布局:隔离区域应保持清晰的器件分区,保证足够的爬电距离与空气间隙以满足 5kVrms 要求;数字走线尽量短且避免跨越隔离边界。
  • 共模瞬变管理:在高 dv/dt 环境下可配合串联电阻、RC 滤波或共模抑制元件,进一步提升抗干扰性能。

四、典型应用场景

  • 工业控制与电机驱动板间数字隔离。
  • 电力电子(逆变器、变频器)中 MCU 与功率部分的信号隔离。
  • 隔离型数据采集、传感器接口与安全栅。
  • 工业现场总线或高速串行链路(SPI、UART 等)的电位隔离。

五、可靠性与选型建议

CA-IS3731HN 以 5kVrms 隔离与 100 kV/µs CMTI 为显著特征,适合对耐压与抗扰度有较高要求的工业与电力电子场合。在选型时应结合系统的绝缘等级、EMC 要求及上电逻辑,确认封装尺寸(SOIC-16)与布局空间匹配。对于需要更高通道数或更高数据率的方案,可考虑多颗器件并行或查询厂商系列中更高性能型号。

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