WMSIC Electronic Components

Chipanalog CA-IS3721CHS

ModelCA-IS3721CHS
PackageSOIC-8
BrandChipanalog
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Chipanalog CA-IS3721CHS
Type
CHIPANALOG
Minimum package
2500 卷

Technical parameters

Electronic Component
CHIPANALOG
Electronic Component
CA-IS3721CHS
Electronic Component
1
Package
SOIC-8
Electronic Component
Isolated
Electronic Component
0.195g
Electronic Component
1
CMTI(kV/us)
150kV/us
Features
Output
Electronic Component
BM0228740294
Operating Temperature
40℃~+125℃
Output
Level
Channel Count
1
Channel Count
1
(tpd)
22ns
Operating Voltage(VCCA)
3V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CA-IS3721CHS 产品概述

一、简介

CA-IS3721CHS 是川土微(Chipanalog)推出的一款隔离数字信号器件,面向工业控制、通信接口和电源管理等场景。器件提供高共模抗扰能力与3750 Vrms的隔离等级,支持双向信号隔离(正向通道1、反向通道1),在恶劣电磁环境中能可靠传输低延迟数字数据。

二、主要特性

  • 最大数据速率:40 Mbps,适合中速串行总线与开关信号。
  • 默认输出电平:高电平(Fail-safe 默认态),便于上电与异常状态的安全处理。
  • 隔离电压(Vrms):3750,满足大多数工业隔离要求。
  • 工作电压:VCCA 3.0 V ~ 5.5 V,VCCB 3.0 V ~ 5.5 V,适配3.3V与5V系统。
  • 传播延迟(tpd):约22 ns,可实现低延时控制与同步。
  • CMTI(共模瞬变抗扰度):150 kV/µs,抗干扰能力强。
  • 工作温度范围:-40 ℃ ~ +125 ℃,适合严苛环境。
  • 封装:SOIC-8,便于PCB布局和自动化贴装。

三、优势亮点

  • 强隔离与高CMTI:3750 Vrms 与 150 kV/µs 的组合,能有效隔离地电位差并抵抗快速共模瞬变,适合驱动侧与被驱动侧地电位不一致的应用。
  • 宽电压兼容性:两侧供电范围均为3.0~5.5V,降低不同逻辑电平系统互联的复杂度。
  • 可靠的默认态:输出默认高电平,有利于防止上电或故障时产生误动作,提升系统安全性。
  • 低延迟:22 ns 的传播延迟适合需要快速响应的控制回路。

四、典型应用

  • 工业现场总线、串行接口隔离(如RS-485、SPI 等中低速链路)
  • 电机驱动控制信号隔离与编码器信号传输
  • 电源与逆变器控制回路的数字隔离
  • PLC、测量与数据采集系统的信号隔离

五、设计与使用建议

  • 电源去耦:建议在VCCA和VCCB各自靠近器件引脚放置0.1µF与1µF的陶瓷电容,降低电源噪声影响。
  • PCB布局:尽量将两侧地(GND_A、GND_B)明确分区,隔离边界留足间距并避免过孔短接,保持隔离距离与爬电距离。
  • 输入/输出终端:依据通信线特性配置合适的上拉/下拉或终端电阻;默认高电平输出可用作上电安全策略的一部分。
  • 共模瞬变防护:在高共模干扰环境下,配合差分滤波或RC滤波器降低输入瞬态对逻辑的影响。
  • 温度管理:器件支持-40~125℃,但在高温与高功率密度PCB上仍需注意散热与热可靠性设计。

六、封装与可靠性

CA-IS3721CHS 提供常见的 SOIC-8 封装,便于批量生产与更换。器件的电气与环境参数适配工业级应用,推荐在设计验证阶段进行实际系统下的隔离与抗扰测试,确保满足系统级安全与 EMC 要求。

总结:CA-IS3721CHS 是一款面向工业及电源控制应用的高性能数字隔离器,结合高隔离电压、强抗扰度、宽供电范围与低延迟特性,为需要可靠隔离与快速响应的系统提供稳健解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.