Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Chipanalog CA-IS3021G
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- Chipanalog CA-IS3021G
- Type
- CHIPANALOG
- Minimum package
- 1000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CHIPANALOG
- Electronic Component
- CA-IS3021G
- Electronic Component
- 1
- Package
- SOIC-8-300mil
- Electronic Component
- Isolated I2C
- Electronic Component
- 0.502g
- Electronic Component
- 1
- CMTI(kV/us)
- 150kV/us
- Electronic Component
- BM0227627131
- Operating Temperature
- 40℃~+125℃
- Clock
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
- Voltage(Vrms)
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CA-IS3021G — Chipanalog（川土微）I2C隔离器产品概述
一、产品概述
CA-IS3021G 是一款面向工业及嵌入式系统的 I2C 总线隔离器，专为在高噪声和高电压差环境下实现安全可靠的数据传输而设计。器件支持双向 I2C 协议信号隔离，时钟方向为单向（SCL 单向隔离），可有效阻断地环与共模干扰，保护主/从设备之间的系统安全与通信完整性。
二、主要参数
- 隔离电压：5000 Vrms（符合工业级隔离标准）
- 共模瞬态抗扰度（CMTI）：150 kV/μs
- 工作温度范围：-40 ℃ ~ +125 ℃
- 时钟方向：单向（SCL 单向）
- 封装：SOIC-8，300 mil 尺寸
- 品牌：Chipanalog（川土微）
三、主要特性
- 高隔离耐压：5 kVrms，适用于工业电源域与信号域之间的可靠隔离。
- 优异的共模抗扰能力：150 kV/μs，保证在高频开关和长线干扰环境下稳定通信。
- 宽温度工作范围：-40 ℃ 至 +125 ℃，满足严苛环境应用需求。
- 兼容标准 I2C 电气特性，支持开漏输出与上拉电阻结构，易于系统集成。
- 小型 SOIC-8 封装，便于 PCB 布局与批量生产。
四、典型应用场景
- 工业控制总线隔离（PLC、驱动模块）
- 电力电子与逆变器控制信号隔离
- 医疗设备与测试测量仪器的信号隔离
- 智能电表、传感器网关与楼宇自动化系统
五、封装与引脚信息
CA-IS3021G 提供 SOIC-8（300 mil）封装，标准引脚间距与脚位定义便于替换与焊接。建议参考器件具体数据手册获取完整引脚排列、绝对最大额定值及典型连接图。
六、系统设计与布局建议
- 上拉电阻：隔离侧与非隔离侧各自使用独立上拉电阻，阻值依据总线电容与速率选择（典型 1 kΩ~10 kΩ）。
- 隔离区走线：确保隔离爬电距离与工艺一致，避免穿越高压区域。
- 去耦电容：在每侧 VCC 靠近芯片引脚放置 0.1 μF 与 1 μF 去耦，提高瞬态稳定性。
- 热管理：在高温环境下保证良好散热与铜箔面积，避免长期温升影响可靠性。
七、选型建议
若系统需在高共模干扰或大电位差场景下保持 I2C 通信完整且要求工业级温度与耐压，CA-IS3021G 是稳健的选择。建议结合具体数据手册确认时序限制、最大速率与电源要求，以获得最佳系统性能与可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
