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Chipanalog CA-IS3742HB
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Chipanalog CA-IS3742HB
- Type
- CHIPANALOG
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CHIPANALOG
- Electronic Component
- CA-IS3742HB
- Electronic Component
- 1
- Package
- SSOP16-NB(B)
- Electronic Component
- Isolated
- Electronic Component
- 0.168g
- Electronic Component
- 1
- CMTI(kV/us)
- 150kV/us
- Electronic Component
- BM0228740288
- Operating Temperature
- 40℃~+125℃
- Output
- Level
- Channel Count
- 2
- Channel Count
- 2
- Operating Voltage(VCCA)
- 2.5V~5.5V
- Operating Voltage(VCCB)
- 2.5V~5.5V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CA-IS3742HB 产品概述
一、产品概览
CA-IS3742HB 是 Chipanalog（川土微）推出的一款高速数字隔离器，适用于需要高共模抑制与可靠隔离的数字信号传输场景。器件提供双向隔离通道：正向通道2路、反向通道2路，默认输出为高电平，最大数据速率可达150 Mbps。该器件设计用于替代传统光耦，在速度、可靠性和寿命方面具有明显优势。
二、主要特性
- 最大数据速率：150 Mbps，满足大部分高速数字接口需求；
- 隔离电压：Vrms 5000 V，提供强抗击穿能力与人员/设备安全隔离；
- CMTI（抗共模瞬态干扰）：150 kV/μs，适合高dv/dt电力电子与驱动侧环境；
- 通道配置：正向2路、反向2路，便于实现双向或差分信号隔离；
- 默认输出：高电平，便于与上位MCU或逻辑电平兼容；
- 工作温度：-40℃ ~ +125℃，适应工业级温度范围。
三、电气与可靠性注意点
器件对布局和去耦较敏感，建议在每个供电端口增加10 nF到100 nF的去耦电容，靠近器件引脚布置；保持隔离区的爬电距离与走线清晰，满足系统安全规范。虽然器件抗CMTI能力高，但在强干扰场合仍建议采取滤波与屏蔽等措施以提高传输可靠性。
四、封装信息
CA-IS3742HB 封装为 SSOP16-NB(B)，适合中等密度PCB布局，便于自动贴装与回流焊工艺。封装引脚排列可支持常见的双向信号分配，方便与MCU、FPGA、驱动器等器件接口。
五、典型应用与选型建议
适用于工业控制、逆变器与电机驱动的隔离控制信号链、数据采集系统的隔离通信、隔离的传感器接口与电源管理控制等场合。选型时若系统存在更高速率或更高隔离等级需求，应对比更高规格产品；若工作环境有强干扰或特殊认证要求，建议与厂商确认完整参数与认证资料。
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