Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Chipanalog CA-IS3988P
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Chipanalog CA-IS3988P
- Type
- CHIPANALOG
- Minimum package
- 2500 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CHIPANALOG
- Electronic Component
- CA-IS3988P
- Electronic Component
- 1
- Package
- SSOP-20
- Electronic Component
- Isolated DI / DO
- Electronic Component
- 0.388g
- Electronic Component
- 1
- CMTI(kV/us)
- 300kV/us
- Electronic Component
- BM0228731303
- Operating Temperature
- 40℃~+125℃
- Output Interface
- IOOutput
- Channel Count
- 8
- Data
- 2Mbps
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CA-IS3988P 数字隔离器 产品概述
一、产品简介
CA-IS3988P 是川土微（Chipanalog）推出的一款高可靠性数字隔离器，采用 SSOP-20 封装，提供 8 路输入通道并以 IO 输出形式隔离传输数字信号。器件针对工业现场强干扰环境设计，支持最高 2 Mbps 的数据速率，隔离电压额定值为 2500 Vrms，且具有高达 300 kV/μs 的共模瞬态抗扰度（CMTI），工作温度范围为 -40℃ 至 +125℃，适合严苛温度与电磁干扰条件下长期稳定运行。
二、主要技术指标
- 输入通道数：8 路
- 输出接口：IO 输出（隔离侧通用数字输出）
- 最大数据速率：2 Mbps
- 隔离电压（Vrms）：2500 Vrms
- 共模瞬态抗扰度（CMTI）：300 kV/μs
- 工作温度：-40℃ ~ +125℃
- 封装：SSOP-20
三、性能特点与优势
- 高抗扰动能力：300 kV/μs 的 CMTI 能有效抑制高速开关和电机驱动等场合产生的共模瞬变，保证隔离信号完整性。
- 可靠隔离等级：2500 Vrms 隔离电压满足多数工业控制与测量应用的安全隔离需求。
- 宽温区设计：-40℃ ~ +125℃ 的工作温度覆盖工业级与近轨迹苛刻环境。
- 紧凑封装：SSOP-20 小型化封装，利于密集布板设计与成本优化。
- 适用多种数字总线：2 Mbps 的带宽使其能胜任 UART、SPI 等常见串行接口的隔离需求（具体协议兼容性请参照系统方向性要求与器件资料）。
四、典型应用场景
- 工业自动化与 PLC 的数字信号隔离
- 电机控制和驱动回路的逻辑隔离
- 数据采集系统与传感器接口隔离
- 可再生能源逆变器控制与监测线路
- 电源管理与远端通信模块的噪声隔离
五、使用建议与电路设计要点
- 电源与去耦：在隔离器两侧的 VCC 引脚靠近芯片放置 0.1 μF 陶瓷去耦电容，必要时补充 1 μF~10 μF 的旁路电容以稳定低频响应。
- 布局与走线：严格分离隔离两侧接地，避免在隔离边界处穿越信号线；遵循器件数据手册中给出的爬电距离和最小电气间隙要求。
- EMC 及筛选：在高 dv/dt 环境中可配合共模电感或 RC 低通滤波以减少干扰传入，保证数据稳定。
- 方向性确认：器件为“输入通道×输出 IO”结构，设计时应确认信号单向/双向需求，必要时结合双向隔离器或额外逻辑实现双向通信。
六、可靠性与质量参考
CA-IS3988P 面向工业级应用，宽温度和高 CMTI 等级提升了在电力电子与工业现场的长期可靠性。实际使用时建议参考厂方提供的完整电气参数表与可靠性测试报告，按标准进行高低温循环、振动与电气应力验证。
七、总结
CA-IS3988P 凭借 8 路输入、2 Mbps 带宽、2500 Vrms 隔离以及 300 kV/μs 的强抗扰性，适合需要稳健隔离与抗干扰能力的工业控制与电源电子系统。其小型 SSOP-20 封装便于系统集成，配合良好 PCB 设计和电源去耦，可以显著提升现场数字信号的可靠传输与系统安全性。若需进一步器件引脚定义、时序和典型应用电路，请参阅厂家详细数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
