WMSIC Electronic Components

Chipanalog CS817X20HS

ModelCS817X20HS
PackageSOIC8(S)
BrandChipanalog
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Chipanalog CS817X20HS
Type
CHIPANALOG
Minimum package
2500 卷

Technical parameters

Electronic Component
CHIPANALOG
Electronic Component
CS817X20HS
Electronic Component
1
Package
SOIC8(S)
Electronic Component
Isolated
Electronic Component
0.356g
Electronic Component
1
CMTI(kV/us)
150kV/us
Electronic Component
BM0242321826
Operating Temperature
40℃~+105℃
Output
Level
Channel Count
0
Channel Count
2
(tpd)
2us
Operating Voltage(VCCA)
2.375V~5.5V
Operating Voltage(VCCB)
2.375V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CS817X20HS 产品概述

CS817X20HS 是川土微(Chipanalog)面向工业级隔离通信设计的一款双通道数字隔离器,提供可靠的两路正向通道隔离传输,适用于需要中低速数字信号隔离的场合。器件在保持低功耗和简化系统设计方面具有明显优势,其 3000 Vrms 的隔离等级与高达 150 kV/µs 的共模抗扰度(CMTI)使其在复杂电磁环境中依然能保证信号完整性与系统安全。

一、主要特性

  • 双通道正向传输(正向通道数:2,反向通道数:0)
  • 最大数据速率:200 kbps,适合 UART、串口通信及低速并行/串行总线隔离
  • 默认输出为高电平(器件未驱动时输出为逻辑高态),便于上拉配置与故障指示
  • 隔离电压:3000 Vrms(典型),满足工业控制与电源域隔离需求
  • 高共模抑制:CMTI = 150 kV/µs,适合含大电流开关、变频器或电机驱动的应用
  • 工作温度范围:-40 ℃ ~ +105 ℃,符合工业级温度要求
  • 工作电压范围:VCCA、VCCB 均为 2.375 V ~ 5.5 V,支持 3.3 V 与 5 V 系统互通
  • 传播延迟(tpd):约 2 µs,适用于非实时高速交换但对延迟有确定性要求的场合
  • 封装:SOIC8 (S),便于 PCB 布局与批量组装

二、典型电气与时序说明

  • 最高数据率 200 kbps 对应的最小时钟周期为 5 µs,配合典型 2 µs 传播延迟可实现稳定的数据传输,但注意系统需预留足够的建立/保持时间裕量。
  • 默认高电平输出说明器件内部或外部存在上拉策略,设计时应确认是否需要外部上拉电阻(常见值 4.7k–100kΩ,依据总线负载与上拉电压选取)。

三、封装与热管理

  • SOIC8 紧凑封装,便于常规 SMT 生产线加工。
  • 在高功率或高温应用下,建议在 PCB 上预留散热铜箔并保证 VCCA/VCCB 两侧有足够旁路电容(例如 0.1 µF 陶瓷)靠近引脚以稳定电源并降低瞬态抖动。

四、典型应用场景

  • 工业现场总线隔离、串口(UART/RS-232/TTL)隔离
  • 电机控制与驱动系统中控制域与功率域隔离
  • 数据采集系统、传感器接口与隔离式遥测
  • 电源管理与隔离监控,需高 CMTI 抗扰的场合

五、设计注意事项

  • 电源旁路:VCCA 与 VCCB 两侧各自靠近引脚放置 0.1 µF 陶瓷电容,并视需要并联 1 µF 或更大电容以抑制低频扰动。
  • 布局隔离:在 PCB 上确保信号隔离区的爬电与间隙距离满足系统安全规范,单面或多层板均需注意隔离走线与接地策略。
  • 抗干扰:在强开关场景下,可在隔离端添加 RC 滤波或共模电感以进一步抑制瞬态干扰,同时确保不影响最大通信速率。
  • 温度与电压裕量:在极限温度与电压下使用时应做功能与寿命测试,保证长期可靠性。

六、可靠性与选型建议

CS817X20HS 面向工业级市场,具备 3 kVrms 隔离与 150 kV/µs CMTI,适合多数工业控制与电力电子隔离需求。选型时注意数据速率与传播延迟的系统匹配,如需更高带宽或双向通道,应选择相应型号或并用隔离芯片组合。

七、封装与采购信息

  • 品牌:Chipanalog(川土微)
  • 型号:CS817X20HS
  • 封装:SOIC8 (S)
  • 典型应用与技术支持可通过厂商提供的器件 Datasheet 获取更详细的电气参数、引脚排列与参考电路。

如需参考电路图、引脚定义或在特定系统(如带有大共模瞬变的电机驱动)中的布局建议,我可以基于具体电路图提供更精确的设计指导。

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