WMSIC Electronic Components

Chipanalog CA-IS2092VW

ModelCA-IS2092VW
PackageSOIC-16-300mil
BrandChipanalog
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Chipanalog CA-IS2092VW
Type
CHIPANALOG
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHIPANALOG
Electronic Component
CA-IS2092VW
Electronic Component
1
Package
SOIC-16-300mil
Electronic Component
Isolated RS485 / 422Transceiver
Electronic Component
1.156g
Electronic Component
1
CMTI(kV/us)
150kV/us
Features
Built-in Power Supply Transformer; Isolated
Electronic Component
BM0228740292
Operating Temperature
40℃~+125℃
Communication
Electronic Component
Data
500Kbps
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CA-IS2092VW 产品概述

一、主要特性

CA-IS2092VW 是川土微(Chipanalog)推出的一款高性能隔离半双工通信收发器,集成隔离供电与通信接口。核心参数包括:最大数据速率 500 kbps、隔离电压 3750 Vrms、共模瞬态免疫(CMTI)150 kV/µs、工作温度范围 -40℃ 至 +125℃。器件提供 3.3V 与 5V 两档集成电源输出与工作电压,封装为 SOIC-16-300mil,适合工业级应用。

二、功能简介

器件将信号隔离与电源隔离集成在单芯片内,支持半双工通信拓扑。内部驱动与接收电路针对高共模瞬态进行了优化,能在强电磁干扰和共模电压扰动环境下保持稳定通讯。内置隔离电源可直接为对端逻辑供电,简化多板或远端模块的供电设计。

三、典型应用场景

  • 工业自动化总线、分布式 I/O 与模块化控制器
  • 仪器仪表与数据采集(DAQ)系统
  • 现场总线接口、网关与协议转换模块
  • 电力电子监控、逆变器与储能系统的隔离通信
  • 楼宇自控与安防系统中的远端节点连接

四、典型规格与参数

  • 最大数据速率:500 kbps(半双工)
  • 隔离电压(Vrms):3750 Vrms(绝缘等级适用于工业侧隔离)
  • CMTI:150 kV/µs(高抗扰度)
  • 工作温度:-40℃ 至 +125℃(工业级)
  • 集成电源:支持 3.3V 与 5V 输出与工作电压选择
  • 封装:SOIC-16-300mil(便于 PCB 布局与 DIP-兼容插座)

五、设计与使用建议

  • 隔离沟槽、爬电距离应满足系统工作电压与安全规范,保持 PCB 两侧接地分离。
  • 在隔离电源输入/输出近侧放置低 ESR 去耦电容,抑制开关噪声与瞬态。
  • 对于长线或高干扰环境,建议在总线两端采用差分终端电阻与 TVS 保护器件。
  • 半双工模式下注意方向控制时序与冲突避免,必要时加入仲裁或方向指示逻辑。
  • 利用器件高 CMTI 特性时仍需关注接地布局与滤波,避免接地环路带来额外共模扰动。

六、封装与可靠性

SOIC-16-300mil 封装便于生产与手工评估,器件经过工业温度等级验证,适合长期工作于严苛环境。标准化封装有利于替换与兼容设计,推荐在可靠性设计中配合符合系统安规的隔离结构与防护元件。

总结:CA-IS2092VW 将高抗扰隔离通信与便捷的隔离电源整合,适合需要可靠隔离、抗干扰能力强且对 PCB 布局有成本与空间考量的工业应用。

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