WMSIC Electronic Components

Chipanalog CA-IS3642HVW

ModelCA-IS3642HVW
PackageSOIC-16-WB
BrandChipanalog
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 64855

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
Chipanalog CA-IS3642HVW
Type
CHIPANALOG
Minimum package
1000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHIPANALOG
Electronic Component
CA-IS3642HVW
Electronic Component
1
Package
SOIC-16-WB
Electronic Component
Isolated
Electronic Component
0.76g
Electronic Component
1
CMTI(kV/us)
150kV/us
Features
Output; Voltage Interface
Electronic Component
BM0228061285
Operating Temperature
40℃~+125℃
Output
Level
Channel Count
2
Channel Count
2
Data
100Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CA-IS3642HVW 产品概述

一、产品简介

CA-IS3642HVW 是川土微(Chipanalog)推出的一款四通道高性能数字隔离器,集成隔离电源,面向工业级应用场景。器件在单芯片内实现数字信号隔离与隔离电源输出,支持多通道双向数据传输,保证在高共模瞬变情况下的抗扰性与系统供电稳定性,适合需要隔离信号和隔离供电的场合,显著简化系统设计与布局。

二、主要特性

  • 四通道数字隔离:正向通道 2、反向通道 2,适配双向控制与返回信号设计。
  • 失效默认输出为高电平,便于系统在隔离故障时保持已定义的逻辑状态。
  • 最大数据速率可达 100 Mbps,满足多数快速数字接口与通信需求。
  • 高隔离电压:继续保持 5000 Vrms 隔离能力,适配工业级电气隔离要求。
  • 高共模瞬变抗扰性(CMTI):150 kV/µs,能在强干扰环境下稳定工作。
  • 集成隔离电源输出:提供 5V 和 3.3V 隔离电源输出,降低外部隔离电源设计复杂度。
  • 输入供电范围宽:集成电源工作电压 3.0 V ~ 5.5 V,支持常见逻辑电平体系。
  • 宽工作温度区间:-40 ℃ ~ +125 ℃,满足严苛工业环境要求。
  • 封装:SOIC-16-WB(宽体 SOIC),便于实现更大爬电距离与板级布线隔离。

三、关键技术参数(概要)

  • 最大数据速率:100 Mbps
  • 默认输出状态:高电平(失效安全高电平)
  • 隔离电压(Vrms):5000 V
  • 通道数:正向 2 通道,反向 2 通道(共 4 通道)
  • CMTI:150 kV/µs
  • 集成隔离电源输出电压:5 V、3.3 V
  • 集成电源工作电压范围:3.0 V ~ 5.5 V
  • 工作温度:-40 ℃ ~ +125 ℃
  • 封装:SOIC-16-WB

(注:以上为器件关键参数摘要,设计时请参照完整数据手册获取详细时序、引脚定义及最大额定值。)

四、典型应用场景

  • 工业自动化控制系统:PLC、运动控制、现场总线接口的信号隔离与供电隔离。
  • 电机驱动与伺服系统:栅极驱动及测量信号隔离,减少高压回流与共模干扰对控制端的影响。
  • 电源与逆变器控制:功率半导体驱动及反馈回路的安全隔离。
  • 数据采集与隔离通信:ADC 前端隔离、隔离 UART / SPI / GPIO 接口。
  • 安全隔离需求的消费及医疗设备(在满足相应认证的前提下)。

五、设计与布局建议

  • PCB 布局:利用 SOIC-16-WB 宽体封装的优势,保证隔离区的爬电距离与空气间距,关键隔离区避免铺铜或通过孔,维持器件两侧清晰的参考地分离。
  • 隔离电源去耦:在集成隔离电源输入/输出侧放置低 ESR 去耦电容(建议贴近引脚),以降低开关噪声与保持稳定输出电压。若需要更低噪声或更大负载能力,可在隔离输出端并联适当滤波与稳压电路,但应考虑总功耗与温升。
  • 信号完整性:对 100 Mbps 速率的信号线采用短走线、阻抗匹配和串联终端等方式控制反射与串扰;长线或高速总线需评估时序与延迟影响。
  • 地与屏蔽:合理规划逻辑侧与隔离侧接地;如系统需要额外屏蔽,确保屏蔽层与某一侧地良好连接并遵循 EMI 控制原则。
  • 散热与温度:在高温或高负载条件下评估器件功耗与周围器件热耦合,必要时增加散热路径或降额设计。

六、可靠性与注意事项

  • 隔离额定值(5000 Vrms)为工厂测试条件下的绝缘耐压数值;实际应用中应结合爬电距离、污染等级和系统长时间运行考虑安全裕度。
  • 高 CMTI(150 kV/µs)显著提升在高干扰场合的信号可靠性,但系统级设计仍需注意快速瞬变源(如开关节点)与数字隔离器信号线的物理隔离与滤波。
  • 在关键安全或医疗系统中,需根据最终应用进行相应认证与验证(如需要 IEC/UL 等认证,请参考器件的认证资料或与厂商确认)。
  • 使用前强烈建议查阅 CA-IS3642HVW 完整数据手册与应用笔记,确认引脚定义、推荐外部元件值以及典型应用电路。

总结:CA-IS3642HVW 将四路高速数字隔离与可用隔离电源集成于单芯片,针对工业与电力电子等需隔离信号与电源的场合提供简化方案。其 100 Mbps 的速率、5000 Vrms 隔离等级与 150 kV/µs 的 CMTI,使其在复杂电磁环境中具备较高的抗扰性与实用性。请在系统设计阶段结合完整手册与 EMC、电气安全规范完成详细验证。

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