WMSIC Electronic Components

Chipanalog CA-IS3742HW

ModelCA-IS3742HW
PackageSOIC-16-300mil
BrandChipanalog
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 64856

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
Chipanalog CA-IS3742HW
Type
CHIPANALOG
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHIPANALOG
Electronic Component
CA-IS3742HW
Electronic Component
1
Package
SOIC-16-300mil
Electronic Component
Isolated
Electronic Component
0.55g
Electronic Component
1
CMTI(kV/us)
150kV/us
Features
Output
Electronic Component
BM0227693251
Operating Temperature
40℃~+125℃
Output
Level
Channel Count
2
Channel Count
2
(tpd)
12ns

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CA-IS3742HW —— 四通道标准数字隔离器 产品概述

一、产品简介

CA-IS3742HW 是川土微(Chipanalog)面向工业与通讯隔离需求推出的一款四通道标准数字隔离器。器件提供 2 路正向(A→B)和 2 路反向(B→A)数字通道,支持高达 150 Mbps 的数据速率,并在常见的工业-汽车级温度范围内可靠工作。器件采用 SOIC-16-300mil 封装,适合 PCB 上的紧凑布置与批量生产装配。

二、主要参数

  • 通道数:正向 2 路,反向 2 路(合计 4 路数字通道)
  • 最大数据速率:150 Mbps
  • 默认输出电平:高(器件具有默认高电平输出特性)
  • 隔离电压(Vrms):5000 Vrms(隔离栅规格)
  • 共模瞬态抗扰度(CMTI):150 kV/µs
  • 工作温度:-40 ℃ ~ +125 ℃
  • 工作电压:VCCA 2.5 V ~ 5.5 V,VCCB 2.5 V ~ 5.5 V
  • 传播延迟(tpd):典型 12 ns
  • 封装:SOIC-16(300 mil)

三、关键特性与优势

  • 高速数据传输:支持高达 150 Mbps,适合 SPI、UART、快速控制信号和短帧并行/串行数据链路的隔离。
  • 双电源域隔离:VCCA/VCCB 可在 2.5 V~5.5 V 范围内独立供电,便于在不同逻辑电平域之间进行电平隔离与互联。
  • 强隔离能力:5000 Vrms 隔离电压,适合工业现场、测量与电源隔离场景,提升系统安全与抗冲击能力。
  • 高共模抑制:150 kV/µs CMTI 提高在强电磁干扰或高速开关环境下的抗扰动能力,适合驱动逆变器、马达控制等高噪声应用。
  • 默认高电平输出:在上电、输入浮空或失能条件下输出为高电平,有利于系统进入安全或确定态,便于系统设计中对默认信号态的控制。
  • 宽工作温度:-40 ℃ 到 +125 ℃,满足工业级与部分汽车电子场景的温度要求。
  • 低延迟:约 12 ns 的传播延迟,适合对时效性有要求的控制与通信链路。

四、典型应用场景

  • 工业控制与自动化:PLC、传感器接口、现场总线隔离、驱动器控制信号隔离。
  • 电力与能源:逆变器、风机与光伏逆变系统中控制信号与测量信号隔离。
  • 通讯接口隔离:隔离 UART、SPI、I2C(注意通道匹配)等数字接口以保护主控与外设。
  • 测量与数据采集:用于将模拟前端或 ADC 的数字输出与主控域隔离,减少共模干扰。
  • 医疗与测试设备(需结合具体认证):对易受高压干扰的测量路径进行功能性隔离。

五、封装与引脚功能(摘要)

CA-IS3742HW 采用 SOIC-16-300mil 封装,器件两侧分属 A 侧(低压侧/主控侧)与 B 侧(被控侧/从属侧)。典型引脚功能包括 A 侧电源 VCCA、A 侧地 GND_A、B 侧电源 VCCB、B 侧地 GND_B,以及 4 路数字输入/输出通道(2 路 A→B、2 路 B→A)。在原理设计时应注意 A、B 两侧电源与地线严格隔离,避免在 PCB 上产生跨区接地。

六、设计与使用建议

  • 电源旁路与去耦:VCCA 与 VCCB 两侧分别使用 0.1 µF 的高频陶瓷电容近端旁路,并辅以 1 µF~10 µF 的电解或钽电容用于低频滤波。
  • PCB 布局:确保 A、B 区之间有足够的爬电/间隙距离,并在层间或边缘布置隔离槽(如需要)以增强耐压性能。将高频信号走线短、粗并避免环路,特别是在高噪声环境下。
  • 默认输出及上电序列:器件默认输出为高电平,系统设计时应考虑此缺省态对外设或负载的影响,必要时通过上电顺序或外部拉低电路控制初态。
  • 抗扰动设计:在需要极强抗干扰的场合,配合差分传输、共模滤波器或磁环等措施可进一步降低 EMI/ESD 影响。
  • 温度与功耗:在高温运行或密集通道工作时评估功耗与散热,必要时采取散热或降低工作频率策略。

七、可靠性与环境适应性

CA-IS3742HW 以工业级温度范围与高隔离等级为基础,适合在苛刻环境下长期稳定工作。高 CMTI 与大隔离电压提高了在高压瞬态与强电磁场下的抗干扰与绝缘安全性。具体的寿命与可靠性应结合应用环境、热管理和工作电压条件进行评估。

八、订购信息与注意事项

  • 型号:CA-IS3742HW
  • 品牌:Chipanalog(川土微)
  • 封装:SOIC-16-300mil
  • 购买或设计导入前,请参考厂方完整数据手册以获取引脚排列图、绝对最大额定值、时序图、典型应用电路与可靠性测试数据。对关键应用(安全、医疗、汽车等)建议确认所有必要的认证与测试结果。

如需对接具体电路示例、引脚对应表或与现有总线(如 SPI、UART)的对接方案,我可以基于您给出的应用场景提供进一步的接线与 PCB 布局建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.