WMSIC Electronic Components

Chipanalog CA-IS3098VW

ModelCA-IS3098VW
PackageSOIC-16-300mil
BrandChipanalog
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 64859

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
Chipanalog CA-IS3098VW
Type
CHIPANALOG
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHIPANALOG
Electronic Component
CA-IS3098VW
Electronic Component
1
Package
SOIC-16-300mil
Electronic Component
Isolated RS485 / 422Transceiver
Electronic Component
0.626g
Electronic Component
1
CMTI(kV/us)
150kV/us
Electronic Component
BM0264863625
Operating Temperature
40℃~+125℃
Communication
Electronic Component
Electronic Component
Electronic Component
Electronic Component
1000
Voltage(Vrms)
5000
Integrated Power Supply Output Voltage
3.3V;5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CA-IS3098VW 产品概述

一、产品简介

CA-IS3098VW 是 Chipanalog(川土微)推出的一款隔离式半双工 RS-485 收发器。器件在单芯片内集成隔离式 DC-DC 转换器及信号隔离结构,逻辑侧与总线侧通过二氧化硅(SiO₂)绝缘栅实现可靠隔离。支持 3.3V 或 5V 单电源供电,适用于需要电气隔离和抗干扰能力强的工业通信场合。

二、主要特性

  • 隔离电压:5000 Vrms,满足高压隔离要求;
  • 共模瞬态抗扰度(CMTI):150 kV/µs,能在强干扰边界保持数据完整性;
  • 集成隔离式 DC-DC,免去外部隔离电源,简化 PCB 布局与物料清单;
  • 支持半双工 RS-485 通讯,多节点总线拓扑;
  • 总线引脚具备 ±20 kV HBM ESD 保护,增强现场可靠性;
  • 工作温度范围宽:-40℃ ~ +125℃;
  • 封装:SOIC-16-300mil,便于常规贴装与替代设计。

三、关键参数(摘要)

  • 通讯模式:半双工;
  • 集成电源输出:3.3V / 5V;
  • 隔离电压(Vrms):5000;
  • CMTI:150 kV/µs;
  • 总线 ESD 抗扰:±20 kV HBM;
  • 工作温度:-40℃ 至 +125℃;
  • 封装:SOIC-16-300mil。

四、典型应用场景

适用于工业自动化现场总线、电机控制、楼宇自控、楼宇能耗计量、远程 I/O、智能仪表、安防与交通设备等需要高可靠隔离通信的系统。

五、设计与使用要点

  • 半双工工作需外部控制 DE/RE 引脚以管理发送与接收方向;
  • 推荐在差分总线上使用终端电阻(例如 120 Ω)和偏置网络以保证总线静态状态;
  • 在布局上将隔离边界清晰划分,隔离区两侧的去耦电容与 DC-DC 输出电容应靠近相应引脚;
  • 在强电磁干扰环境中可配合共模电感与TVS保护件提升抗干扰与浪涌抑制能力;
  • 请参考芯片详细数据手册以确认引脚配置、电源滤波和保护元件选型。

六、封装与可靠性

SOIC-16-300mil 封装便于批量生产与替换,宽温工作范围和高 ESD 容限使其在工业现场环境下具备长期可靠性。CA-IS3098VW 通过集成隔离电源与 SiO₂ 隔离栅技术,为需要减少地环路、提升抗干扰性能的 RS-485 系统提供高度集成的解决方案。

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