WMSIC Electronic Components

Chipanalog CA-IS3088WX

ModelCA-IS3088WX
PackageSOIC-16-300mil
BrandChipanalog
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 64861

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
Chipanalog CA-IS3088WX
Type
CHIPANALOG
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHIPANALOG
Electronic Component
CA-IS3088WX
Electronic Component
1
Package
SOIC-16-300mil
Electronic Component
Isolated RS485 / 422Transceiver
Electronic Component
0.89g
Electronic Component
256
Electronic Component
1
CMTI(kV/us)
150kV/us
Features
Bus
Electronic Component
BM0222279400
Operating Temperature
40℃~+125℃
Receiver
1
Communication
Electronic Component
Electronic Component
±20kV

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CA-IS3088WX 产品概述

概述

CA-IS3088WX 是川土微(Chipanalog)公司推出的一款高性能集成电路(IC),其封装为 SOIC-16-300mil。这款芯片广泛应用于各种模拟信号处理及相关应用,因其卓越的性能和灵活性的设计而备受青睐。

主要特性

  1. 高精度: CA-IS3088WX 在模拟信号处理领域提供了极高的精度,可有效减少信号失真和噪声。其设计目标是满足高要求行业标准,使其适用于各种严苛应用。

  2. 低功耗: 该 IC 的功耗设计合理,适合用于需长时间工作而又对电源消耗有严格限制的设备,保证在节能的同时不影响性能表现。

  3. 宽工作范围: CA-IS3088WX 支持广泛的工作电压范围,能够适应不同的应用环境,增强了其灵活性及适用性。

  4. 高增益带宽: 此芯片具备较高的增益带宽积(GBW),使其能够有效处理更高频率的信号,适合用于高速数据传输及信号处理需求的场景。

  5. 出色的共模抑制比(CMRR): 由于其先进的设计,CA-IS3088WX 的共模抑制比表现优异,能够在共模干扰较为复杂的环境中提供稳定的信号输出。

应用领域

CA-IS3088WX 可以广泛应用于多种领域,包括但不限于:

  • 音频处理: 由于其高精度和低失真特性,适合用于音频放大、效果处理等设备,有助于提升音频质量。

  • 传感器信号处理: 该芯片能够有效处理各种传感器信号(如温度、压力、光照等),因此可以应用于仪器仪表、智能家居和工业自动化等领域。

  • 医疗设备: 在医疗监测与诊断设备中,CA-IS3088WX 的高精度及高可靠性使其成为理想之选,如心电图(ECG)和超声波成像等设备中的信号之处理单元。

  • 仪表与测量设备: 支持各类电子仪表,使其能够在实验室环境及工业测试中提供精准的信号测量。

  • 通信系统: CA-IS3088WX 也可以在通信设备中用作信号调制和解调的数字信号处理器,有助于提升整个通信系统的稳定性和可靠性。

设计与集成

设计工程师在将 CA-IS3088WX 集成到他们的系统时,可以依托于其兼容性与灵活性进行快速设计。由于采用 SOIC-16-300mil 封装,这种封装形式易于焊接及布局,有助于简化生产过程。

此外,CA-IS3088WX 的使用文档详细,包括电路范例、应用笔记以及推荐的外部元件,使设计工程师能够迅速上手并有效地应用于产品开发中。

结论

CA-IS3088WX 是川土微公司在模拟信号处理领域的一款卓越产品,凭借其高精度、低功耗和广泛的应用场景,满足了现代电子设计对性能和效率的高要求。无论是在音频处理、传感器应用,还是在医疗设备和通信系统中,它都展现出优越的性能,是各类电子产品开发的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.