WMSIC Electronic Components

Chipanalog CS48520AS

ModelCS48520AS
PackageSOIC8(S)
BrandChipanalog
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 64865

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
Chipanalog CS48520AS
Type
CHIPANALOG
Minimum package
2500 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHIPANALOG
Electronic Component
CS48520AS
Electronic Component
1
Package
SOIC8(S)
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.186g
Electronic Component
256
Electronic Component
1
Electronic Component
BM0259314339
Operating Temperature
40℃~+125℃
Operating Voltage
3V~5.5V
Receiver
1
Data
20Mbps
Communication
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CS48520AS 产品概述

CS48520AS 是川土微(Chipanalog)推出的一款工业级半双工差分收发器,面向多节点、高抗扰的串行现场总线应用。器件集成 1 路驱动器与 1 路接收器,工作电压范围宽(3.0V~5.5V),通信速率高达 20 Mbps,支持多达 256 个节点,工作温度范围 −40℃~+125℃,并具备高达 ±20 kV 的静电防护能力(对人体模型/空气放电典型等级),适合恶劣环境下的稳定数据传输需求。器件采用 SOIC8(S) 封装,便于表面贴装与自动化装配。

一、功能与性能要点

  • 半双工差分通信:内部支持 DE/RE 控制信号,用于半双工总线方向切换,适配 RS-485 类差分总线拓扑。
  • 宽电源电压:3.0V 至 5.5V 范围,兼容 3.3V 与 5V 系统,便于与 MCU、FPGA 等直接接口。
  • 高速传输:最高数据速率 20 Mbps,满足高速测控与工业以太外的短帧高速通信场景。
  • 多节点支持:器件设计允许系统扩展至 256 个节点,适用于大型分布式网络。
  • 强抗静电:对外接口静电防护达 ±20 kV,提升现场安装与维护时的可靠性。
  • 宽温度工作:−40℃~+125℃,适合工业级与汽车电子等严苛温度环境。

二、引脚与封装说明

  • 封装形式:SOIC8(S),标准小外形,便于 PCB 布局与散热管理。
  • 常用引脚:驱动输出 A/B、接收输入 A/B、DE(驱动使能)、RE(接收使能)、VCC、GND。(实际引脚排列请参考器件数据手册)
  • PCB 布局建议:差分对走线成对、阻抗匹配,靠近器件末端放置终端电阻与共模变压器/滤波器,VCC/GND 使用充足旁路电容减小电源噪声。

三、典型应用场景

  • 工业现场总线(多节点数据采集、分布式控制)
  • 智能楼宇(照明、安防传感网络)
  • 仪器仪表与数据采集系统(高噪声环境下的可靠通信)
  • 机器人与运动控制(多节点实时通信)
  • 其他需要差分半双工通信且要求抗电磁干扰与静电能力的嵌入式系统

四、设计与使用建议

  • 总线终端:在总线两端采用匹配终端电阻(常见 120Ω)以抑制反射;对长线或高速链路须注意阻抗匹配。
  • 停止态偏置:为确保空闲总线具有确定的电平,可在驱动器空闲时采用上拉/下拉偏置电阻或使用器件内部的 failsafe 方案(如有)。
  • 使能控制:合理规划 DE/RE 控制逻辑,避免总线冲突;建议使用片选或主控统一管理发送时序。
  • 电源与去耦:在 VCC 近端放置 0.1 μF 与 1 μF 旁路电容并做好地平面设计,减小瞬态电流影响。
  • 抗干扰与保护:在存在高能瞬变的环境下,可在差分线加入共模扼流圈与浪涌抑制器件,进一步提升系统鲁棒性。

五、可靠性与选型参考

CS48520AS 针对工业级应用进行了温度与 ESD 加强设计,适合需要长时间稳定运行与频繁现场操作的系统。选型时应同时考虑系统总线拓扑、节点数量、线缆长度与速度要求,必要时在样机阶段进行总线完整性与电磁兼容性测试。器件的 SOIC8(S) 封装利于规模化生产,但若对尺寸或散热有特殊要求,可咨询厂商查看其它封装或定制方案。

总结:CS48520AS 是一款面向工业与复杂现场环境的高可靠半双工差分收发器,凭借宽电压、宽温度、高速率与强静电防护,能够为多节点分布式通信系统提供稳定、抗扰的物理层解决方案。欲获取详细引脚定义、时序及典型应用电路,请参考厂商提供的数据手册或联系川土微技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.