WMSIC Electronic Components

CRMICRO CRJD390N65GC

ModelCRJD390N65GC
PackageTO-252
BrandCRMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CRMICRO CRJD390N65GC
Type
CRMICRO
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CRMICRO
Electronic Component
CRJD390N65GC
Electronic Component
1
Package
TO-252
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.473g
Electronic Component
1
Electronic Component
BM0257642403
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
74W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
650V
Capacitor(Ciss)
770pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CRJD390N65GC 产品概述

一、主要参数与特点

CRJD390N65GC 是华润微(CRMICRO)推出的一款高压N沟场效应管,适用于高压开关应用。主要电气参数如下:

  • 极性:N沟道,数量:1个
  • 漏源电压 Vdss:650 V
  • 连续漏极电流 Id:11 A
  • 导通电阻 RDS(on):390 mΩ @ Vgs=10 V(在 Id=5.5 A 测试条件下)
  • 阈值电压 Vgs(th):4.5 V(典型,表示不是逻辑电平驱动型)
  • 栅极电荷 Qg:22 nC @ Vgs=10 V(反映驱动能量需求)
  • 输入电容 Ciss:770 pF @ 100 V;反向传输电容 Crss:23 pF @ 100 V
  • 耐温范围:工作结温 Tj:-55 ℃ ~ +150 ℃
  • 功耗 Pd(额定耗散):74 W(条件依赖,实际需参考散热方式)
  • 封装:TO-252(DPAK),表面贴装,利于PCB散热与自动化生产

二、性能分析与驱动建议

  • 导通与阈值:Vgs(th)=4.5 V 表明该器件需接近 10 V 栅压才能达到标称 RDS(on),不属于 5 V 逻辑驱动型。在驱动器选择上建议采用能提供 10–12 V 有效驱动的栅极驱动器。
  • 开关损耗:Qg=22 nC 与 Ciss=770 pF 表明开关时需一定驱动电流,若工作在较高频率(几十 kHz 以上)应使用驱动器输出能力较强的栅极驱动芯片或并联驱动晶体管,并在栅极串联小电阻(典型 5–47 Ω)以控制振铃与限流。
  • 反向特性:Crss=23 pF 对开关瞬态敏感,建议在高 dv/dt 场合采用栅极阻尼与适当的吸收回路,降低误触发与振幅。

三、典型应用场景

  • 离线开关电源主开关或初级侧开关(如反激、正激、半桥)
  • 功率因数校正(PFC)电路中高压开关(低/中功率)
  • 工业电源、LED 驱动、照明整流与高压变换器
  • 高压逆变及辅助电源场合(需关注 SOA 与热管理)

四、热管理与封装建议

TO-252(DPAK)为表面贴装封装,适合在 PCB 上通过较大铜箔做散热。尽管器件标称 Pd=74 W,但实际耗散能力强烈依赖于 PCB 铜面积、层间散热通道及环境温度,设计时应按温升和结温限制进行功率降额(derating)。推荐增加顶层与底层铜箔,使用过孔导热至散热层或背面散热片,并在高温条件下设置安全裕度。

五、布局与保护建议

  • 布局:将高电流回路尽量缩短并扩大铜面积,减少回路电感,栅极走线尽量短且与电源回路分离。
  • 保护:在反激/开关瞬态场合使用 RCD 吸收或 TVS 钳位,防止瞬态超压。对易受反向恢复影响的应用,可在需处加 RC 吸收或软开关策略。
  • 测试:实际应用中建议进行热成像和开环/闭环功率损耗测试,验证 SOA 与热稳定性。

六、选型与使用注意事项

在选用 CRJD390N65GC 时,应根据工作电压、占空比、开关频率与导通损耗综合评估。若需要更低导通电阻或更高频率性能,可考虑同类 650 V 器件中 RDS(on) 更低、Qg 更小的产品。设计时务必参考完整数据手册,确认最大结温、脉冲SOA、最大反向恢复能量等关键参量,确保长期可靠运行。

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