Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CRMICRO F601D-G F601D
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CRMICRO F601D-G
- Type
- CRMICRO
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CRMICRO
- Electronic Component
- F601D-G
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.044g
- Electronic Component
- 1
- Electronic Component
- BM0226507857
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 600V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
F601D-G 产品概述
一、概述
F601D-G 是华润微（CRMICRO）推出的一款高压小信号N沟道绝缘栅场效应管（MOSFET），封装为SOT-23，适合在空间受限且需耐高压、低电流的场合使用。器件标称耐压为600V，额定连续漏极电流较小（30mA），功耗上限500mW，定位于高压启动、保护与小信号开关类应用。
二、主要特性
- 漏源电压（Vdss）：600V，适用于高压边应用。
- 阈值电压（Vgs(th)）：1V @ 8.0µA，开通起始电压较低，便于驱动检测。
- 连续漏极电流（Id）：30mA，适合小电流场合，不用于大电流导通。
- 耗散功率（Pd）：500mW，SOT-23封装下热耗散有限，需注意散热。
- 输入电容 Ciss：15.5pF，输出电容 Coss：4.7pF，反向传输电容 Crss：1.6pF，开关过程中的结电容较小，有利于快速响应和降低米勒效应。
- 工作温度范围：-55℃～+150℃，适用于严苛温度环境。
注意：产品描述中有“600V，300Ω”的表述，未明确300Ω指何参数（可能为开路态电阻或其它），推荐以完整数据手册为准。
三、电气参数解析与设计要点
- 小信号电流能力决定其不适合做主功率开关，适于启动电路、驱动电源的高压检测、限制或保护元件。
- 较低的Coss、Crss 有利于快速电压变化下降低能量吸收和振铃，但米勒电容仍会影响栅极驱动波形，设计驱动电路时应考虑驱动阻抗与栅极电荷。
- Pd 与封装限制意味着在高温和连续导通条件下需降额使用，通过增大PCB铜箔面积及合理走线改善散热。
四、典型应用场景
- 开关电源启动电路（高压启动管/限流器）
- 高压检测与隔离开关（例如峰值检测、保护断路）
- 小信号高压开关或放大器前端
- 测量仪器、电视机/显示器高压辅助电路、LED驱动的高压控制段
五、封装与布局建议
- SOT-23 封装体积小，焊接时应保证底铜面积和热沉路径，必要时在PCB底层增加大面积铜箔并做通孔过孔连接以提高热散。
- 栅极上加并联阻容抑制振荡，避免高速脉冲时产生不稳定。
- 由于高压，应保持足够爬电距离和绝缘设计，防止表面闪络。
六、使用与可靠性提示
- 器件对静电敏感，建议在贴片和手工焊接时采取ESD防护措施。
- 在实际电路中，请参考完整数据手册的绝对最大额定值（尤其是Vgs绝对值、脉冲电流与能量吸收能力）以及典型测试条件。
- 在高温或频繁开关的场合做热仿真与寿命评估，必要时选用额定更高的器件或并联/级联方案。
七、选型建议
如需在SOT-23封装下实现高压小信号开关或启动保护，F601D-G 提供了600V耐压与低结电容的组合，是较为合适的选择。若应用要求更大导通电流或更低导通损耗，请考虑功率型封装或低Rds(on)的高压MOSFET，并以华润微完整数据手册为最终判定依据。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
