WMSIC Electronic Components

CrossChip CC6920BSO-10A CC6920BSO

ModelCC6920BSO-10A
PackageSOP-8
BrandCrossChip
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Cross Chip CC6920BSO-10A
Type
CROSSCHIP
Minimum package
2000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CROSSCHIP
Electronic Component
CC6920BSO-10A
Electronic Component
1
Package
SOP-8
Electronic Component
250kHz
Electronic Component
Current Sensor
Electronic Component
0.122g
Electronic Component
132mV/A
Electronic Component
1
Electronic Component
BM0230874179
Operating Temperature
40℃~+125℃
Operating Voltage
3.3V
Current
20mA
Current Resistor
0.9mΩ
(tr)
1us

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CC6920BSO-10A 单芯片差分霍尔电流传感器 — 产品概述

一、产品简介

CC6920BSO-10A 是 CrossChip(成都芯进)推出的一款单芯片差分霍尔电流传感器,采用 SOP-8 封装,支持双向电流检测,测量范围为 ±10A。器件对被测回路实现磁隔离,隔离电压达 3500 Vrms,适用于对安全和隔离有较高要求的电流检测场合。工作温度范围宽 (-40℃ 至 +125℃),可满足工业级环境。

二、主要电气参数

  • 测量范围:-10A ~ +10A(双向)
  • 电流端电阻(内阻):0.9 mΩ,降低回路功耗与温度漂移
  • 灵敏度:132 mV/A(差分输出对电流成线性比例)
  • 工作电压:3.3 V
  • 待机电流:20 mA
  • 带宽:250 kHz,适合高速动态测量
  • 响应时间 (tr):1 μs
  • 隔离电压 (Vrms):3500 Vrms
  • 封装:SOP-8

三、产品特性与优势

  • 高精度差分霍尔测量:差分输出有助于抑制共模干扰,提高系统抗干扰能力,便于直接与差分放大器或仪表放大器配合使用。
  • 低插入电阻:0.9 mΩ 的低电流端电阻将功耗和发热降到最低,适合大电流连续测量场合。
  • 宽带宽与快响应:250 kHz 带宽和 1 μs 响应时间,满足电机驱动、逆变器及快速功率电子设备的即时电流检测需求。
  • 工业级工作温度与高隔离强度:-40℃ 至 +125℃ 的范围和 3500 Vrms 的隔离电压,适合工业、能源与电力电子系统。

四、典型应用场景

  • 电机驱动与伺服系统的实时电流监测与保护
  • 逆变器、太阳能与风电并网设备的电流采样
  • 电池管理系统(BMS)与电源管理的双向电流检测
  • 过流保护、电能计量和工业控制回路的隔离测量

五、使用建议与注意事项

  • 电源旁路:建议在 VCC 近端并联 0.1 μF 陶瓷电容与 1 μF 以上电解/钽电容以降低电源噪声对测量精度的影响。
  • 前端滤波:根据应用需要可在差分输出添加小信号 RC 滤波以限制带宽并抑制高频干扰,但注意不要过度影响响应时间。
  • 接地与布局:差分输出对地共模环境敏感,PCB 布局时应缩短信号线,隔离敏感模拟地与数字地,保持良好接地回路。
  • 热管理:虽然电流端电阻低,但长时间大电流可能导致封装温升,需考虑散热与布局间距,避免影响零点漂移。
  • 校准与温度补偿:建议在系统启动或定期进行零点与增益校准,以消除器件及系统引入的偏差。

六、封装与选型

  • 封装:SOP-8,便于 SMT 贴装与批量生产。
  • 型号示例:CC6920BSO-10A(±10A 量程)——订购时请确认量程、封装与温度等级。

如需电气特性曲线、典型应用电路图或引脚说明,请告知使用场景与系统接口(例如是否直接接 ADC、是否需要差分放大),我可提供更具体的接法建议与评估。

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