Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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ZVN3320FTA 是一款高性能的 N沟道金属氧化物半导体场效应管(MOSFET),专为低功耗应用设计。它的主要电气特性包括:漏源电压(Vdss)高达 200V,具有良好的漏极电流承受能力(Id 为 60mA @ 25°C),以及低漏源导通电阻(Rds On)为 25Ω @ 100mA,10V。此产品适合需在高电压及中等电流条件下稳定工作的电子电路,特别是用于开关、线性放大以及驱动应用中。
高电压和电流能力: ZVN3320FTA 具有 200V 的漏源电压能力,在多个高压应用中表现出色。在连续漏极电流的承受能力方面,其最大值为 60mA,使得产品能够处理适中的电流负载。
低导通电阻: 该设备特有的导通电阻(Rds On)为 25Ω,使其在导通状态时电压降小,从而提高能效,并减少发热。这对于开关电源和电机驱动等应用尤为重要。
适应广泛的工作环境: ZVN3320FTA 的工作环境温度范围宽广,可以在 -55°C 到 150°C 的温度下工作,这使得它非常适合航空、汽车及工业控制等高温和低温环境应用。
紧凑的封装: SOT-23-3 封装设计不仅节省空间,而且便于表面贴装(SMD),适合高密度电路板的布局。其紧凑的设计使得其能够适配现代电子设备紧凑的设计需求。
较高的栅源极阈值电压: 栅源极阈值电压(Vgs(th))为 3V @ 1mA,保证了产品能够在较低的栅电压下实现导通,使得设计人员能够更容易地集成控制电路。
ZVN3320FTA 适用于多种场景,包括但不限于:
ZVN3320FTA 是由美台半导体(DIODES)公司制造的,作为一个知名的半导体供应商,他们在全球范围内为多种市场提供高质量和高可靠性的电子元器件。
总的来说,ZVN3320FTA 是一款多功能、高性能的 N沟道 MOSFET,具备200V的高耐压和低导通电阻等优良特性,适合应用于多种电子设计和控制系统。其紧凑的封装设计和广泛的工作温度范围,使得它在现代电子设备中有广泛的适用性。随着电子设备对高效能和小型化的不断需求,ZVN3320FTA 提供了一种理想的解决方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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