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DOWO CUS08F30
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO CUS08F30
- Type
- DOWO
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- CUS08F30
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Electronic Component
- BM0228536752
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 1mA@30V
- (Vf)
- 875mV@3A
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CUS08F30 产品概述
一、主要特性
CUS08F30 为 DOWO（东沃）出品的一款小型表面贴装整流二极管，采用 SOD-323 封装。该器件设计用于低至中等功率整流及保护应用，具有体积小、可靠性高的特点。典型优势包括低正向压降、较低的反向漏电以及能承受短时浪涌冲击能力，适合空间受限的消费电子及工业产品。
二、电气参数
- 额定整流电流（If）：1A（连续工作条件下）
- 正向压降（Vf）：0.875V @ 3.0A（典型测量点，实际使用中应按额定电流参考）
- 直流反向耐压（Vr）：30V（最大反向电压）
- 反向电流（Ir）：1mA @ 30V（最大）
- 非重复峰值浪涌电流（Ifsm）：9A（单次浪涌承受能力）
以上参数表明 CUS08F30 在 30V 以下电压等级中可以提供可靠的一安培整流能力，并能短时承受高达 9A 的浪涌电流（例如开机或负载突变时）。
三、封装与机械特性
- 封装：SOD-323（超小型贴片封装）
- 适用于高密度 PCB 布局，节省空间。SOD-323 封装的导热能力受限，建议在 PCB 设计时配合散热铜箔与热沉布局以提升连续功率处理能力。
四、典型应用场景
- 开关电源次级整流与续流保护
- 电池管理与充放电保护（30V 以下系统）
- 信号或电源的反向极性保护
- 消费类电子、通信设备和轻工工业控制中的通用整流用途
五、使用注意与建议
- 对于长期 1A 连续工作，务必考虑 PCB 的散热设计：增加焊盘面积、热 vias 或邻近铜箔以降低结温。
- 浪涌能力为非重复峰值 9A，若应用中存在频繁大电流冲击，应选择更高 Ifsm 或并联器件并注意电流均衡。
- 反向漏电 1mA 在高温或高电压边界可能影响低功耗电路，敏感应用需评估温漂与漏电对系统的影响。
- 焊接工艺兼容常见回流曲线，但建议遵循厂方焊接温度曲线以防损伤器件。
六、布局与典型电路建议
- 推荐短、粗的走线连接正、负极以减小串联阻抗与热量集中。
- 在整流或保护位置加入适当的旁路电容与浪涌吸收元件（如 TVS 或 RC）以抑制尖峰与降低应力。
- 对于需要更低正向压降的场合，可评估并联多个相同器件或选用专用低 Vf 型二极管。
七、可靠性与存储
- 在常规电子元器件环境温度和湿度下存放，避免潮湿与酸性气体侵蚀。
- 在高温回流后建议进行外观及电气参数抽样检测，确保焊接质量与电性能稳定。
总结：CUS08F30 以其小体积、1A 整流能力及良好的浪涌承受力，适合在 30V 以下的多种应用中作为常规整流或保护器件使用。合理的 PCB 热设计与正确的使用方法能显著提升器件的长期可靠性与性能稳定性。
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