WMSIC Electronic Components

DOWO SMD3225-300M SMD3225

ModelSMD3225-300M
Package1210
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO SMD3225-300M
Type
DOWO
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
SMD3225-300M
Electronic Component
1
Electronic Component
2.5mm
Package
1210
Electronic Component
2
Electronic Component
(GDT)
Electronic Component
±20%
Electronic Component
0.15g
Electronic Component
3.2mm
Electronic Component
2.5mm
Electronic Component
1
Electronic Component
BM0264356191
Operating Temperature
40℃~+85℃
Capacitor
0.5pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD3225-300M — 贴片陶瓷气体放电管产品概述

一、产品简介

SMD3225-300M(品牌:DOWO/东沃)是一款1210封装(3.2×2.5×2.5 mm)的贴片陶瓷气体放电管(GDT),为两极结构的过压浪涌保护器件。该器件以较高的脉冲放电能力与极低的极间电容为特点,适用于需要对大能量浪涌进行削峰泄放且对线路带宽有较高要求的场合。

主要参数一览:

  • 极数:2
  • 直流击穿电压 Vdc:300 V(±20%)
  • 冲击击穿电压 Vimp:800 V
  • 脉冲放电电流:1 kA(典型脉冲能力)
  • 极间电容:0.5 pF(典型)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装/尺寸:1210 / 3.2×2.5×2.5 mm

二、主要特性与优势

  • 高能量吸收能力:可承受高达1 kA级别的脉冲放电,适合雷击或大幅度浪涌环境。
  • 极低寄生电容:0.5 pF 的极间电容有利于保持高速信号完整性,适合通信接口与高频电路。
  • 稳定的触发电压:标称直流击穿300 V,公差±20%,便于工程选型与并联配合。
  • 封装小巧:1210 SMD尺寸,便于在空间受限的板面上布置并兼容自动贴装与回流焊流程。
  • 宽工作温度范围:满足工业级温度要求。

三、典型应用场景

  • 通信接口保护(如DSL、光纤收发器I/O、以太网端口前端)
  • 工业控制和远程测控设备的浪涌与雷击保护
  • 电源和配电系统的输入侧初级防护(与后级TVS/阻尼器配合)
  • 铁路、安防、能源等对高能量浪涌防护要求的系统

四、选型与设计建议

  • 与TVS二极管搭配:气体放电管擅长大能量、低阻抗浪涌泄放,但触发速度慢于TVS。建议采用GDT+TVS的多级防护结构——GDT负责大能量泄放,TVS负责快速钳位。
  • 考虑击穿公差:300 V ±20%意味着实际直流触发范围约240 V—360 V;设计时留有余量以避免误触发或不可靠触发。
  • 布局注意:为发挥低电感优势,应将GDT紧贴需保护的信号线与地线/参考面放置,走线尽量短且避免环路面积增大。
  • 高频应用:得益于0.5 pF低电容特性,适用于对信号完整性敏感的高速接口,但仍需验证在目标频段的插损影响。

五、封装与焊接

  • 封装形式:1210 SMD,兼容常见贴片工艺。
  • 装配建议:支持标准回流焊工艺,但在回流曲线和焊膏用量上应按工艺规范验证;焊接后建议进行目视或X射线检查。
  • 存储与处理:避免剧烈机械冲击,保持清洁,存放环境避免极端湿度温度。

六、使用注意事项

  • 不建议用于持续工作电压长期处于或接近击穿电压区的场景;GDT为瞬态防护器件,长期带压可能影响寿命或发生跳火。
  • 对于关键安全应用,建议进行实际浪涌试验验证(例如8/20 μs或其他客户要求波形),以确认系统级防护能力。
  • 并联或串联使用时需确认触发匹配与均流问题,必要时采取合适的限流/阻尼措施。

总结:SMD3225-300M(DOWO)以小型封装、低电容与高脉冲放电能力为优势,适合对大能量浪涌具有刚性防护需求且又对信号带宽有严格要求的应用场合。在实际应用中建议与快速钳位器件配合,并遵循合理的PCB布局与热机械工艺规范以确保长期可靠性。

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