WMSIC Electronic Components

DOWO 3R090M-S5076 3R090M

Model3R090M-S5076
PackageSMD-3P,7.6x5mm
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO 3R090M-S5076
Type
SMD-3P, 7.6X5MM
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
3R090M-S5076
Electronic Component
1
Electronic Component
5mm
Package
SMD-3P,7.6x5mm
Electronic Component
3
Electronic Component
(GDT)
Electronic Component
±20%
Electronic Component
1.885g
Electronic Component
7.6mm
Electronic Component
5mm
Electronic Component
1
(φD)
5mm
Electronic Component
BM0230826984
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

3R090M-S5076 产品概述

一、产品简介

3R090M-S5076 是 DOWO(东沃)推出的一款 SMD 封装多极浪涌保护器件,封装形式为 SMD-3P(7.6×5mm)。器件以小体积实现大电流脉冲放电能力与低寄生电容,适用于通信接口、电源输入和各种需抗雷击/浪涌干扰的电子系统前端保护。未分类定位使其在方案选型时具有较强的通用性。

二、主要参数

  • 脉冲放电电流(Iimp):5 kA(峰值)
  • 直流击穿电压(Vdc):90 V
  • 冲击击穿电压(Vimp):700 V
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 宽度:5 mm;长度:7.6 mm;高度:5 mm;直径(φD):5 mm
  • 极数:3(SMD-3P)
  • 极间电容:1 pF(典型)
  • 精度(击穿电压容差):±20%

三、核心特性

  • 高浪涌承受能力:5 kA 的脉冲放电能力,能有效吸收来自雷击或开关冲击的短时高能量脉冲。
  • 低漏通和稳定的静态特性:直流击穿电压约 90 V,保证在正常工作电平下无导通。
  • 低寄生电容:约 1 pF 的极间电容,对高速差分信号影响极小,适合数据线保护。
  • 紧凑封装:7.6×5×5 mm 的 SMD-3P 体积,便于在有限 PCB 面积上实现多路保护方案。
  • 宽温工作:-40 ℃ 到 +85 ℃,适应工业级温度要求。

四、典型应用场景

  • 通信设备:用于以太网端口、DSL、光模块保护等需要低电容且耐大电流冲击的接口。
  • 电源输入防护:适配 24 V、48 V 等直流系统的前端防雷保护(需结合系统电压确认适配性)。
  • 工业控制与监控:PLC、现场总线及远程终端设备的浪涌与脉冲干扰防护。
  • 智能终端与安防:摄像头、电力监测与路由器等对抗电磁脉冲和雷击的保护单元。

五、设计与布局建议

  • 布局靠近受保护端口:将器件放在受保护线缆入口或接口附近,最小化导线长度可提高保护效率。
  • 接地处理:若为对地保护结构,确保接地面低阻、短回路,使用粗短回流路径以降低接地电感。
  • 与滤波器配合:可与串联电感/共模电感及差分/共模电容协同使用构成多级保护,注意整体带宽匹配以免影响信号完整性。
  • 焊接工艺:作为 SMD 器件,推荐采用标准回流焊工艺,焊盘设计应符合厂商推荐(如需具体封装图请咨询供应商)。
  • 温升与散热:在高能量冲击场景下,保持周围无易燃物并保证器件有足够的热散路径。

六、可靠性与环境适应

  • 工作温度覆盖工业级范围,适应户外/工业环境的温度变化。
  • 击穿电压容差为 ±20%,在设计中应留有裕量以应对工况差异与老化带来的参数漂移。
  • 对于频繁高能冲击的场合,建议在工程验证阶段进行寿命评估及多次冲击后性能检测。

七、选型与采购建议

在选型时,应结合系统的最大工作电压、信号速率与预期的冲击等级(如波形、能量)确认 90 V 的直流击穿与 700 V 的冲击击穿是否满足需求。低极间电容(1 pF)适合高速数据线保护;若用于更高直流电压或更大冲击能量环境,应考虑更高等级产品或并联/混合保护方案。欲获取封装图、推荐焊盘与 tape-and-reel 包装规格,请联系 DOWO(东沃)或授权分销商。

如需针对具体电路(例如以太网、PoE、汽车电子)提供接入方案与器件并联/串联建议,可提供电路工作电平与冲击波形,我方可给出更精确的布局与选型建议。

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