Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DOWO MBR0530
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO MBR0530
- Type
- DOWO
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- MBR0530
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0230826982
- Current
- 500mA
- Diode
- 1
- Current(Ir)
- 130uA@30V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MBR0530（DOWO）产品概述
一、产品概要
MBR0530 是 DOWO（东沃）出品的一款小功率肖特基整流二极管，SOD-123 封装，额定直流整流电流 500mA，直流反向耐压 30V。典型正向压降为 0.43V（I=0.5A），单次非重复峰值浪涌电流为 5.5A，反向漏电流在 30V 时约 130µA。该器件面向低压、高效率和空间受限的应用场景，兼顾开关速度和低压降优势。
二、主要特性
- 低正向压降：Vf = 0.43V @ 0.5A，有利于降低整流损耗与发热，适用于低压差供电系统。
- 快速恢复与肖特基特性：响应快、无反向恢复时间，适合高频开关电源与整流场合。
- 良好的浪涌能力：Ifsm = 5.5A，能承受短时启动或冲击电流（具体测试脉冲条件见厂家资料）。
- 小体积封装：SOD-123，便于表面贴装与高密度 PCB 布局。
三、电性能与热管理
在连续工作条件下，建议按额定整流电流 500mA 考虑热平衡：整流功耗约为 P = Vf × I（约 0.215W @0.5A），但在高温或高占空比场合，反向漏流会显著上升，从而增加总损耗与自热。SOD-123 封装散热能力有限，推荐适当铺铜（增加焊盘铜箔面积）或在必要时采用散热加强措施，并在 PCB 设计中考虑元件的热降额（ambient 温度升高时降低允许电流）。
四、典型应用
- 开关电源次级整流与输出箝位
- DC-DC 转换器、低压轨整流
- 反向极性保护与电源防反接电路
- 二次侧 OR-ing / 冗余电源切换
- 小功率充电器与便携设备电源管理
五、设计与选型建议
- 若系统工作在较高环境温度或长时间高电流运行，应选择更大电流或更强散热能力的封装或并联器件。
- 对于敏感低泄漏电路（如高阻输入），130µA 的反向漏流在 30V 下可能不可忽略，应评估温度变化带来的漏流增长。
- 焊接与装配时遵循 SMD 工艺规范，避免超出封装耐热限制，确保焊点可靠性。
- 参考具体应用的浪涌脉冲条件与 PCB 热阻，必要时向供应商获取更详尽的热特性与波形测试条件。
MBR0530 在体积、效率与成本间提供了良好平衡，适合空间受限且对低压降有要求的低功率整流场景。选择时请结合实际工作温度、瞬态浪涌需求与系统允许的漏电容忍度进行综合评估。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
