Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TA-I Technology RMS10FT3300
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RMS10FT3300
- Type
- TA-I Technology
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RMS10FT3300
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 330Ω
- Electronic Component
- 1
- Electronic Component
- BM0264899858
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RMS10FT3300（330Ω ±1% 0805 厚膜贴片电阻）产品概述
一、产品简介
RMS10FT3300 为大毅科技推出的高可靠性厚膜贴片电阻，阻值 330Ω，精度 ±1%，额定功率 125mW，封装规格 0805（公制 2012，约 2.0 × 1.25 mm）。本产品针对表面贴装（SMT）工艺优化，适合中高密度电路板及批量生产需求，具有良好的温度稳定性与焊接可靠性。
二、主要参数
- 电阻类型：厚膜电阻（贴片）
- 阻值：330Ω
- 精度：±1%（F）
- 额定功率：125mW（常温参考值，典型按 70°C 环境）
- 最大工作电压：150V
- 温度系数（TCR）：±100 ppm/°C
- 工作温度范围：-55°C 至 +155°C
- 封装：0805（2012 公制）
- 品牌：大毅科技
三、产品特点与优势
- 抗焊接热冲击：适配常见回流焊流程，工艺兼容性好，便于批量 SMT 装配。
- 精度与温稳：±1% 精度结合 ±100 ppm/°C 的温度系数，满足常规模拟和数字电路对阻值精度和温漂的要求。
- 小型化封装：0805 尺寸在占板面积与功耗之间取得平衡，适合功耗不高但要求体积紧凑的设计。
- 电压承受能力：最高工作电压 150V，适用一定电压等级的分压、限流等电路场合。
- 成本与可得性：厚膜工艺优势使其在中低成本应用中具备良好性价比。
四、典型应用场景
- 工业与消费电子中的分压器、偏置电路与去耦网络
- 传感器信号调理、滤波及参考回路（配合其他元件使用）
- LED 驱动、键盘与接口限流保护（在功耗限制内）
- 通信设备、仪器仪表及一般电子模块的通用阻值需求
五、可靠性与焊接建议
- 温度降额：建议在高温环境下按厂家降额曲线使用；常见做法为在 70°C 以上开始线性降额至 155°C。
- 回流焊兼容：适用于标准 SMT 回流焊工艺（典型回流峰值温度区间约 250–260°C），为保证可靠性，请参考大毅科技的回流焊曲线和焊接工程规范。
- 储存与防潮：建议防潮包装存放，开盘后按 EIA/IPC 建议及时使用或放置于干燥条件下。
- 可靠性试验：通过常见的温度循环、湿热和机械冲击试验能验证长期稳定性（具体试验条件请参照厂家数据表）。
六、包装与选购建议
- 常见包装：卷带包装（适配自动贴片机）；亦可提供散装或特殊需求包装。
- 选购提示：选型时应确认工作环境温度、最大电压及允许功耗，必要时考虑更大封装或更高功率等级以保证长期可靠性。
- 型号识别：RMS10FT3300 表示本系列中 330Ω、0805、±1% 的具体型号，具体订购和现货情况请联系大毅科技或授权经销商获取最新供货信息与技术支持。
如需更详细的电气特性曲线、回流焊曲线、封装尺寸图或长期稳定性数据，可提供具体需求，我将协助获取或解析相关技术资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
