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TA-I Technology RLM20FECR050
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RLM20FECR050
- Type
- TA-I Technology
- Minimum package
- 4000 圆盘
Technical parameters
- Power
- 1W
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RLM20FECR050
- Electronic Component
- 1
- Package
- 2010
- Electronic Component
- Current Sense Resistor / Shunt
- Electronic Component
- ±1%
- Electronic Component
- 0.059g
- Electronic Component
- 50mΩ
- Electronic Component
- 1
- Electronic Component
- BM0264549197
- Electronic Component
- SMD
- Electronic Component
- ±50ppm/℃
- Resistor Type
- Current Sense Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RLM20FECR050 产品概述
一、主要特性
RLM20FECR050 为大毅科技推出的一款表面贴装型电流采样电阻（分流器），额定功率 1W，阻值 50 mΩ，公差 ±1%，温度系数（TCR）±50 ppm/℃，封装为 2010（贴片）。该器件专为低阻、高精度电流检测与闭环控制设计，适合要求稳定、线性和小尺寸占板的应用场景。
二、产品参数（关键信息）
- 电阻类型：采样电阻/分流器（低阻）
- 阻值：50 mΩ（0.05 Ω）
- 精度：±1%
- 额定功率：1 W（额定环境与散热条件下）
- 温度系数：±50 ppm/℃（温度漂移小，利于精确测量）
- 封装/安装：2010 贴片（SMT）
- 品牌：大毅科技
三、性能计算与选型提示
- 最大持续电流（理论）：I = sqrt(P/R) = sqrt(1W / 0.05Ω) ≈ 4.47 A。实际应用中需考虑PCB散热与环境温度，建议按热降额留出裕量（例如持续工作电流常按 70%~85% 的理论值选型）。
- TCR ±50 ppm/℃ 表示随温度变化的阻值漂移较低，适合对温漂敏感的电流采样场合。
- ±1% 精度适合大多数电源管理、动力电池监测与电机控制中的电流检测需求。
四、典型应用
- 开关电源（SMPS）与负载电流检测
- 电池管理系统（BMS）采样电阻
- 电机控制器与驱动器电流反馈
- MCU/ADC 前端电流检测与保护电路
- 工业控制与测量终端的低阻分流场合
五、封装与安装建议
- 将采样电阻布置在主电流回路的合适位置，靠近电源或负载端，确保测量点电流真实反映负载。
- 为保证散热，应在阻器引脚焊盘处增加铜箔面积并连接到内层散热铜，必要时采用过孔与内层铜平面增强散热。
- 推荐遵循制造商的PCB land pattern 与回流焊工艺参数；回流时遵循通用无铅回流曲线，避免超温和过长停留时间。
六、热管理与可靠性
- 在高环境温度或受限散热条件下，电阻需要热降额使用；热阻越小、铜箔散热越好，允许的持续电流越高。
- 长期稳定性受焊接温度、热循环和过载影响，设计时应预留裕度并做实际温升验证（例如温升测量或热仿真）。
七、储存与使用注意
- 存放于干燥、无腐蚀气体的环境，避免潮湿和强酸碱接触；长期存储建议防潮包装。
- 焊接时采用标准SMT回流工艺，避免二次加热导致焊点应力集中。
- 选型时结合实际测量电流、工作温度及 PCB 散热能力，必要时联系供应商获取封装推荐焊盘尺寸与热阻数据。
该型号以小尺寸、高精度与良好温漂特性为优势，适合空间受限且需稳定电流采样的电子系统。若需进一步的阻值公差分配、温升曲线或封装 land pattern，请提供具体 PCB 敷铜条件或向大毅科技索取详细数据手册。
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