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TA-I Technology RLP25FEGMR001
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RLP25FEGMR001
- Type
- TA-I Technology
- Minimum package
- 4000 圆盘
Technical parameters
- Power
- 3W
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RLP25FEGMR001
- Electronic Component
- 1
- Package
- 2512
- Electronic Component
- Current Sense Resistor / Shunt
- Electronic Component
- ±1%
- Electronic Component
- 0.084g
- Electronic Component
- 1mΩ
- Electronic Component
- 1
- Electronic Component
- BM0264899865
- Electronic Component
- SMD
- Electronic Component
- ±50ppm/℃
- Resistor Type
- Current Sense Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RLP25FEGMR001 产品概述
一、产品简介
RLP25FEGMR001 是大毅科技推出的一款高稳定性贴片采样电阻（分流器），封装尺寸为 2512，标称阻值 1 mΩ，阻值精度 ±1%，额定功率 3W，温度系数（TCR）为 ±50 ppm/℃。该器件专为电流测量与保护电路设计，适用于需要低压降、高精度电流取样的场合。
二、主要电气与热参数
- 阻值：1 mΩ（0.001 Ω）±1%
- 额定功率：3 W（基于器件与 PCB 散热条件）
- 温度系数：±50 ppm/℃，保证随温度变化的阻值漂移较小
- 封装：2512 贴片，利于大电流热量散发与自动贴装工艺
示例：在 10 A 工作电流下，压降约为 10 mV，耗散功率约 0.1 W；理论极限电流（不考虑散热裕度）约为 sqrt(3 W / 0.001 Ω) ≈ 55 A，但实际使用应按 PCB 散热与环境温度进行余量设计。
三、产品特点与优势
- 低阻值、低压降：用于电流检测对系统影响最小。
- 高精度 ±1%：减少测量误差，配合校准可进一步提高系统精度。
- 低 TCR（±50 ppm/℃）：温度变化下阻值稳定，有利于长温范围内一致性测量。
- 2512 大尺寸封装：更好的热功率承载能力，适合中高电流路径。
- 适配自动化生产：贴片工艺兼容回流焊与常见贴装流程。
四、典型应用场景
- 电池管理系统（BMS）电流检测与保护
- 开关电源与逆变器电流取样
- 电机驱动与伺服系统的电流监测
- 服务器与通讯电源电流监控模块
五、选型与 PCB 布局注意事项
- 散热设计：依据实际工作电流和环境，增加铜箔面积与过孔以提升散热，避免接近器件极限功耗。
- 测量精度：建议采用四端（Kelvin）测量或差分放大器以消除焊盘与引线电阻影响。
- 布线规则：取样端短且粗，测量信号线远离噪声源和大电流回路，布线保持对称与屏蔽。
- 焊接工艺：遵循回流曲线，避免过高温度和长时间热应力造成阻值漂移或开裂。
- 环境与可靠性：考虑温度循环、振动应力对焊点与片体的影响，必要时选用粘胶固定提高可靠性。
六、可靠性与包装
RLP25FEGMR001 采用适合自动化贴装的卷盘包装（Tape & Reel），便于 SMT 线生产。出厂前经过电阻值、功率承载及温度系数筛选，适配工业与商用等多种应用。使用中建议参考大毅科技提供的产品数据手册进行详细热阻、寿命与焊接工艺验证，以获得最佳长期稳定性。
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