WMSIC Electronic Components

TA-I Technology RLP25FEER030

ModelRLP25FEER030
Package2512
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RLP25FEER030
Type
TA-I Technology
Minimum package
4000 圆盘

Technical parameters

Power
2W
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RLP25FEER030
Electronic Component
1
Package
2512
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.084g
Electronic Component
30mΩ
Electronic Component
1
Electronic Component
BM0264549190
Electronic Component
SMD
Electronic Component
±50ppm/℃
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RLP25FEER030 电流采样电阻产品概述

一、产品基本信息

RLP25FEER030是大毅科技推出的一款贴片式电流采样电阻/分流器,采用2512标准贴片封装,专为中功率场景下的电流精准检测设计。其核心基础参数明确:阻值为30毫欧(30mΩ)、精度±1%、额定功率2W、温度系数(TCR)±50ppm/℃,可满足多数工业及消费电子领域的电流采样需求。

二、核心技术参数详解

一、阻值与精度

30mΩ为低阻值设计,可有效降低电流采样时的功率损耗,避免对被测电路造成额外影响;±1%的精度等级,能保证在常规工作条件下,采样电流与实际电流的偏差控制在合理范围内,满足电源、电机驱动等场景的基本精度要求。

二、功率承载能力

额定功率2W,结合阻值计算可得持续工作电流约8.16A(公式:(I=\sqrt{P/R}),代入(P=2W)、(R=30mΩ)),峰值电流可根据降额曲线适当提升,适合中功率设备的电流监测(如10A以内的电机驱动、电源输出)。

三、温度稳定性

±50ppm/℃的温度系数,意味着当环境温度变化1℃时,阻值漂移仅为(30mΩ×50×10^{-6}=0.0015mΩ);即使温度波动达100℃,总漂移也仅0.15mΩ,对采样精度影响极小,适合宽温工作环境(如-55℃~125℃常规工业温度范围)。

四、封装与安装

2512贴片封装(尺寸约6.4mm×3.2mm),体积小巧,可直接通过自动化贴片机焊接于PCB板,兼容性强,无需额外插件空间,适合高密度电路设计。

三、典型应用场景

RLP25FEER030凭借低阻、高精度、高功率密度的特点,广泛应用于以下领域:

一、电源系统

  • 开关电源、DC-DC转换器的输出电流采样,实现输出功率监控与过流保护;
  • 大功率充电器(如笔记本电脑、电动车充电器)的充放电电流检测,优化充电效率。

二、电机驱动

  • 无刷直流电机(BLDC)、伺服电机的电流反馈回路,配合控制器实现精准调速与过载保护;
  • 工业变频器的电流检测,提升电机运行稳定性。

三、电池管理系统(BMS)

  • 电动车、储能电池组的充放电电流监测,及时识别过充/过放状态,保障电池安全与寿命。

四、工业控制

  • PLC(可编程逻辑控制器)、变频器的电流采样,实现设备状态监控与故障诊断。

四、产品优势与特点

  1. 低阻高效:30mΩ低阻值减少采样损耗,避免影响被测电路性能;
  2. 精度可靠:±1%精度满足多数应用场景的采样需求,无需额外校准;
  3. 温度稳定:±50ppm/℃ TCR降低温度对阻值的影响,适合宽温环境;
  4. 高功率密度:2512封装实现2W功率,空间利用率高于插件式分流器;
  5. 安装便捷:贴片封装兼容自动化生产,降低人工成本与焊接难度;
  6. 品牌品质:大毅科技的工业级制造工艺,确保产品长期稳定运行。

五、选型与使用注意事项

  1. 电流容量控制:持续工作电流需不超过8A(基于额定功率),避免过流导致电阻烧毁;
  2. 散热设计:大电流下需在PCB上增加散热铜箔或扩大焊盘面积,降低电阻表面温度;
  3. 精度匹配:若需更高精度(如±0.5%),需根据应用场景选择对应型号;
  4. 温度范围确认:需确保工作环境温度在产品额定范围(一般-55℃~125℃)内;
  5. 焊接规范:遵循贴片焊接工艺(如回流焊温度曲线),避免虚焊影响阻值与功率承载。

总结

RLP25FEER030是一款性能均衡的贴片电流采样电阻,覆盖中功率电流检测的核心需求,兼具低阻、高精度、高稳定性与便捷安装的特点,适配电源、电机、BMS等多领域应用,是工业及消费电子设备中电流监测的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.