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TA-I Technology RLP25FEGR075
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RLP25FEGR075
- Type
- TA-I Technology
- Minimum package
- 4000 圆盘
Technical parameters
- Power
- 3W
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RLP25FEGR075
- Electronic Component
- 1
- Package
- 2512
- Electronic Component
- Current Sense Resistor / Shunt
- Electronic Component
- ±1%
- Electronic Component
- 0.072g
- Electronic Component
- 75mΩ
- Electronic Component
- 1
- Electronic Component
- BM0264549158
- Electronic Component
- SMD
- Electronic Component
- ±50ppm/℃
- Resistor Type
- Current Sense Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RLP25FEGR075 产品概述
一、产品概述
RLP25FEGR075 是大毅科技推出的一款贴片型电流采样电阻（分流器），封装为 2512，阻值 75mΩ，标称功率 3W，精度 ±1%，温度系数（TCR）±50ppm/℃。该器件专为要求高精度、低温漂的电流检测场合设计，适合电源管理、电池管理、DC-DC 转换、马达驱动及测量仪器等领域。
二、主要参数
- 型号：RLP25FEGR075
- 品牌：大毅科技
- 封装：2512（贴片）
- 阻值：75mΩ
- 精度：±1%
- 额定功率：3W
- 温度系数：±50ppm/℃
三、性能特点
- 低阻值设计，压降小，适合高电流测量，降低系统功率损耗；
- ±1% 精度保证短路电流、限流与反馈环路的稳定性；
- ±50ppm/℃ 的低 TCR 提供优异的温漂性能，在温度变化下保持测量一致性；
- 2512 大尺寸封装利于散热，适配高功率密度应用。
四、典型应用
- 电池管理系统（BMS）的充放电电流检测；
- 开关电源与同步整流电流采样；
- 电机驱动与伺服系统的瞬时电流监测；
- 便携与工业测量设备的精准电流感测。
五、热特性与散热建议
RLP25FEGR075 的额定功率为 3W，但实际可用功率受PCB温升与环境影响。建议：
- 在铜皮较厚的 PCB 区域铺大面积散热铜箔；
- 在封装下方及两侧布局若干过孔（thermal vias）将热量引导至内外层铜；
- 依据系统工作温度进行功率降额，必要时进行热仿真评估。
六、安装与板级布局建议
- 推荐采用标准 2512 焊盘尺寸并遵循厂家推荐的回流焊温度曲线；
- 为保证测量精度，PCB 布线应采用 Kelvin（四线）测量法或保持测量引线与电流主回路分开；
- 避免在电阻附近布局高频干扰源，减小热耦合与误差。
七、可靠性与注意事项
- 适用常规回流焊工艺，注意避免过高峰值温度和长时间热冲击；
- 长期高温、大电流运行会影响寿命，应按设计规范进行降额；
- 存储与运输时避免机械应力与潮气侵入，建议按电子元器件常规防潮要求处理。
八、订购信息与选型建议
RLP25FEGR075 适用于需要在有限压降下进行高精度电流测量的场合。选型时如需更低阻值、更高功率或不同 TCR/精度等级，可联系大毅科技获取完整系列及样片支持。购买时请确认封装、阻值公差与批次一致。
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