WMSIC Electronic Components

TA-I Technology RLP25FEGR060

ModelRLP25FEGR060
Package2512
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RLP25FEGR060
Type
TA-I Technology
Minimum package
4000 圆盘

Technical parameters

Power
3W
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RLP25FEGR060
Electronic Component
1
Package
2512
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.072g
Electronic Component
60mΩ
Electronic Component
1
Electronic Component
BM0264549159
Electronic Component
SMD
Electronic Component
±50ppm/℃
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

大毅科技RLP25FEGR060 功率电流采样电阻产品概述

大毅科技RLP25FEGR060是一款专为中功率电流检测场景设计的贴片式采样电阻(分流器),凭借精准的阻值控制、稳定的温阻特性及适配自动化贴装的2512封装,成为工业控制、电源管理等领域的可靠电流检测核心组件。

一、产品核心定位与功能属性

RLP25FEGR060属于功率型电流采样电阻,核心作用是通过“低阻压降检测”实现电路电流的精准采集——当电流流经电阻时,其两端产生的微小电压降(V=I×R)可被后续运放、ADC等电路采集,进而换算出实际电流值。区别于普通贴片电阻,该产品针对电流采样场景优化了阻值精度、温阻稳定性及功率承载能力,避免因电阻性能波动导致的电流检测误差。

二、关键参数详解与应用价值

1. 阻值与精度:基础检测的精准保障

  • 阻值:60mΩ(毫欧级),属于低阻范畴,可在电流流经时产生低功耗压降(如5A电流时压降仅0.3V),既不干扰主电路正常工作,又能提供可被精准检测的电压信号;
  • 精度:±1%,在25℃标准环境下,阻值波动范围为59.4mΩ~60.6mΩ,满足多数工业级电流检测需求(如电机驱动的电流闭环控制)。

2. 功率承载:适配中功率场景

  • 额定功率:3W(25℃环境下),支持持续工作的功率上限,可覆盖中小功率电源、电机驱动等场景(实际工作电流需控制在√(3/0.06)≈7.07A以内,高温场景需降额使用);
  • 降额特性:随温度升高,功率承载能力下降(如100℃时额定功率约为25℃的60%),需结合环境温度调整工作电流,保证长期可靠性。

3. 温度系数:宽温下的稳定性支撑

  • 温系:±50ppm/℃,即温度每变化1℃,阻值变化±50×10^-6倍。例如,环境温度从25℃升至100℃(变化75℃),阻值变化约±0.375%,远低于精度等级,可有效减少户外充电桩、工业现场等宽温场景的检测误差。

三、封装与安装特性

1. 2512贴片封装:空间与工艺适配

  • 封装尺寸:英制2512(对应公制6.4mm×3.2mm×0.5mm),属于中型贴片封装,比0805、1206封装功率承载能力更强,同时适配自动化SMT贴装,适合高密度PCB设计(如电源模块、控制板);
  • 焊接兼容性:支持回流焊、波峰焊等主流工艺,焊接后可靠性高,可通过振动、温度循环等验证。

2. 安装注意事项

  • 需保证PCB焊盘与2512封装匹配,避免焊盘过小导致散热不良;
  • 采样电路建议采用Kelvin四端接法,减少接触电阻对电压检测的影响,进一步提升采样精度。

四、典型应用场景

RLP25FEGR060的性能特点使其适配多类电流检测场景:

  1. 工业自动化:电机驱动、变频器的电流闭环控制,PLC输入电流监测;
  2. 电源管理:开关电源、UPS的输出电流检测,BMS单体电池电流监控;
  3. 消费电子:大功率充电器、笔记本电源适配器的过流保护,电视背光驱动电流检测;
  4. 通信设备:基站电源模块电流监测,光纤设备电源电流控制。

五、品牌与品质背书

大毅科技作为专业元器件制造商,其产品通过严格品质管控:

  • 符合RoHS、REACH环保标准,无铅焊接兼容;
  • 经过高温老化、85℃/85%RH湿度测试、10~2000Hz振动测试等可靠性验证,满足工业级长期稳定要求;
  • 批量生产阻值一致性好,参数波动小,适合大规模工业化应用。

综上,大毅科技RLP25FEGR060以精准采样性能、稳定宽温特性及自动化适配封装,成为中功率电流检测场景的优选组件,可有效提升电路电流控制与保护的可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.