Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TA-I Technology RLP25FEGR005
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RLP25FEGR005
- Type
- TA-I Technology
- Minimum package
- 4000 圆盘
Technical parameters
- Power
- 3W
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RLP25FEGR005
- Electronic Component
- 1
- Package
- 2512
- Electronic Component
- Current Sense Resistor / Shunt
- Electronic Component
- ±1%
- Electronic Component
- 0.06g
- Electronic Component
- 5mΩ
- Electronic Component
- 1
- Electronic Component
- BM0264549161
- Electronic Component
- SMD
- Electronic Component
- ±50ppm/℃
- Resistor Type
- Current Sense Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RLP25FEGR005 产品概述
一、产品简介
RLP25FEGR005 为大毅科技推出的贴片电流采样电阻（分流器），封装规格为 2512，阻值 5mΩ，额定功率 3W，精度 ±1%，温度系数 ±50ppm/℃。该器件专为精确电流检测与功率测量设计，适用于对低压大电流测量有稳定性和精度要求的电子系统。
二、主要参数
- 阻值：5 mΩ
- 精度：±1%
- 额定功率：3 W（2512 封装）
- 温度系数（TCR）：±50 ppm/℃
- 安装方式：贴片（SMD）
- 产品型号：RLP25FEGR005（大毅科技）
三、性能要点
- 低阻值减少电压降，适合高电流路径下的电流采样；
- ±50 ppm/℃ 的低温漂保证在温度变化时读数稳定，利于精密测量与闭环控制；
- ±1% 精度满足多数电源管理与电池管理系统的采样要求；
- 2512 封装在满足 3W 功耗的同时，便于自动贴装与批量生产。
四、典型电气估算
按照 P = I^2·R 计算，该阻值在不考虑散热余量时的理论最大允许电流约为 24.5 A，对应压降约 122.5 mV。实际系统设计应考虑环境温度、PCB 散热和长期功率降额，建议在额定功率下留有裕量。
五、典型应用场景
- 电池管理系统（BMS）与便携电源监测；
- 开关电源、DC-DC 转换器电流检测与过流保护；
- 服务器、电信与工控电源监控；
- 电机驱动与逆变器控制回路的电流采样。
六、设计与使用建议
- 建议采用 Kelvin（四端）测量或尽量缩短测量引线，降低接触与引线误差；
- 在 PCB 布局上为分流电阻提供良好散热通道（加大铜箔面积或通过孔散热）；
- 推荐在接近热源、且温度梯度稳定的位置放置，避免温度漂移影响精度；
- 遵循厂商的回流焊工艺规范，避免超温或机械应力导致可靠性问题。
七、选型与采购提示
RLP25FEGR005 适合需要低压降、稳定温漂和较高功耗能力的电流采样场合。选型时关注实际工作电流、允许压降与散热条件，若工作电流较高或需更小阻值，可考虑更大封装或并联方案。有关封装图、回流曲线及可靠性数据，建议向大毅科技索取详细规格书以便最终验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
