WMSIC Electronic Components

TA-I Technology RLP25FEER500

ModelRLP25FEER500
Package2512
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RLP25FEER500
Type
TA-I Technology
Minimum package
4000 圆盘

Technical parameters

Power
2W
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RLP25FEER500
Electronic Component
1
Package
2512
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.072g
Electronic Component
500mΩ
Electronic Component
1
Electronic Component
BM0264549149
Electronic Component
SMD
Electronic Component
±50ppm/℃
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

大毅科技RLP25FEER500电流采样电阻产品概述

一、产品定位与核心价值

RLP25FEER500是大毅科技针对工业级电流监测场景推出的贴片式高精度分流器,核心定位为“低损耗、高稳定、紧凑化”电流采样元件。作为电流回路的关键感知部件,其价值在于通过低阻特性降低采样功耗,同时以高精度和宽温稳定性保证电流测量的可靠性,适配电源、电机驱动、工业控制等领域的小型化设计需求。

二、关键参数与性能优势

该电阻的核心参数与性能亮点可总结为“四高一稳”:

  • 高精度:固定阻值500mΩ(0.5Ω),阻值精度±1%,满足工业级电流采样的误差控制要求(无需额外校准即可实现可靠测量);
  • 高功率密度:额定功率2W,在2512贴片封装下(尺寸6.4mm×3.2mm)实现约1W/mm²的功率密度,支持最大采样电流约2A(由(I=\sqrt{P/R})计算);
  • 高温度稳定性:温度系数(TC)±50ppm/℃,即温度每变化1℃,阻值漂移不超过50×10⁻⁶Ω,宽温环境下(如-55℃~125℃)性能稳定;
  • 高一致性:批量产品阻值偏差控制在±1%以内,激光微调工艺保证批次间性能一致;
  • 安装便捷:标准贴片封装,兼容自动化贴装、回流焊工艺,适合批量生产。

三、封装与工艺特性

RLP25FEER500采用2512英制贴片封装,工艺设计针对电流采样的特殊需求优化:

  • 电阻体材料:选用高稳定锰铜合金(低热电势、低温度系数),避免温度变化和电流方向切换带来的额外误差;
  • 阻值微调:激光蚀刻工艺精确调整阻值,确保±1%精度,同时减少传统 trimming 带来的性能波动;
  • 封装结构:陶瓷基片承载电阻体,表面环氧树脂涂层隔离湿度、腐蚀环境,金属电极采用镍钯金镀层,提升焊接可靠性与抗硫化能力。

四、可靠性与环境适应性

该电阻经过多项工业级可靠性测试,适配复杂工况:

  • 负载寿命:70℃环境下施加100%额定功率(2W),持续1000小时后阻值变化≤0.5%,满足长期运行需求;
  • 耐温性能:工作温度范围-55℃125℃,温度循环测试(-55℃125℃,1000次循环)后阻值无明显漂移;
  • 抗振动冲击:可承受10G(10~2000Hz)振动、50G(1ms半正弦波)冲击,适合车载、工业现场等振动环境;
  • 焊接兼容性:支持无铅回流焊(峰值260℃,持续10~20s),焊接后电极无脱落、阻值无异常。

五、典型应用场景

RLP25FEER500的特性使其广泛覆盖以下领域:

  1. 开关电源:AC/DC适配器、DC/DC转换器的输出电流采样,用于过流保护、电压反馈,高功率密度适配电源模块紧凑设计;
  2. 电机驱动:BLDC无刷电机、伺服电机的电流闭环控制,低TC保证宽温下电流测量准确,支持动态响应;
  3. 电池管理系统(BMS):小功率储能电池、动力电池的充放电电流监测,低阻特性降低采样损耗,延长电池续航;
  4. 光伏逆变器:并网电流采样,高精度保证电能计量准确,宽温稳定性适配户外环境;
  5. 工业控制:PLC、变频器的电流监测,抗振动特性适合工业现场复杂工况。

总结

大毅科技RLP25FEER500作为一款高性价比贴片采样电阻,以“低阻+高精度+高功率+宽温稳定”的核心优势,解决了电流采样中“精度与功耗/体积平衡”的痛点,是工业控制、电源、电机驱动等领域的可靠选择。其标准化封装与稳定工艺,也为客户批量生产提供了便利。

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