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TA-I Technology RLP25FEER100
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RLP25FEER100
- Type
- TA-I Technology
- Minimum package
- 4000 圆盘
Technical parameters
- Power
- 2W
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RLP25FEER100
- Electronic Component
- 1
- Package
- 2512
- Electronic Component
- Current Sense Resistor / Shunt
- Electronic Component
- ±1%
- Electronic Component
- 0.084g
- Electronic Component
- 100mΩ
- Electronic Component
- 1
- Electronic Component
- BM0264549177
- Electronic Component
- SMD
- Electronic Component
- ±50ppm/℃
- Resistor Type
- Current Sense Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RLP25FEER100 产品概述
一、产品简介
RLP25FEER100 为大毅科技推出的贴片式电流采样电阻（分流器），阻值 100 mΩ，标称功率 2 W，电阻精度 ±1%，温度系数（TCR）±50 ppm/℃，封装规格 2512。该器件专为电流检测与电源管理设计，在保证低压降的同时具有良好的温度稳定性与长期重复性，适用于汽车电子、工业电源、充电设备及电池管理系统等场合。
二、主要性能与数值说明
- 阻值：100 mΩ（0.1 Ω）
- 标称功率：2 W（实际散热能力受 PCB 及环境影响，应按降额使用）
- 精度：±1%
- 温度系数：±50 ppm/℃（示例：温度变化 50℃ 时电阻变化约 0.25%）
- 封装：2512（SMD）
典型电气计算：
- 最大连续电流（理想散热条件下）Imax = sqrt(P/R) = sqrt(2/0.1) ≈ 4.47 A
- 电压降举例：1 A → 0.10 V，2 A → 0.20 V，4 A → 0.40 V
- 总误差示例（静态）：±1%（阻值容差）+±0.25%（50℃ 温差下 TCR）≈ ±1.25%
三、应用场景
- 低压大电流采样：DC-DC、DC-AC 变换器反馈回路
- 电池管理系统（BMS）：充放电电流测量与保护
- 电源模块与服务器电源分配电路的电流监控
- 便携与消费类设备的过流检测
四、安装与布局建议
- 使用标准 2512 PCB 封装及焊盘，保证焊盘尺寸与制造规范一致。
- 为获得接近标称功率的散热能力，应在元件焊盘下及周围布置较大面积的铜箔，并尽量增加过孔/热盲孔引入内层铜平面散热。
- 在测量端采用 Kelvin（四线）感测理念：把电压采样点尽量靠近电阻焊盘，用独立细线/走线送至放大器输入，避免测量引线压降影响精度。
- 推荐在走线与元件附近保留合理间距，避免热源集中影响稳定性。
五、使用注意与测试建议
- 功率降额：器件额定功率通常基于特定参考环境（如 25℃ 和较大散热铜面），实际应用中应按 PCB 散热能力和环境温度进行降额计算。
- 温漂与校准：±50 ppm/℃ 的 TCR 已较小，但在高精度测量系统中仍建议在系统级做一次温度补偿或标定。
- 焊接工艺：遵循无铅回流温度曲线规范，避免长时间超温。参考器件厂商的焊接资料。
- 可靠性测试：建议在样机阶段做热循环、长期负载老化与阻值漂移测试，以验证在目标系统内的长期稳定性。
RLP25FEER100 以其低阻值、较高功率和优良温度系数，适合对电流测量精度与热稳定性有较高要求的设计场合。结合合理的 PCB 散热与测量布局，可在多种电源与电池管理应用中提供可靠的电流采样方案。若需更详细的封装尺寸、回流曲线或样片测试数据，建议直接联系大毅科技获取完整数据手册。
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