Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ES1D 是 DIOTEC(德欧泰克)出品的一款 Superfast 整流二极管,采用 SMA(DO-214AC)表面贴装封装,适用于中高频开关电源与通用整流场合。器件额定反向耐压 200V,平均整流电流 1A,结温可承受 -50℃ 至 +150℃,具有快速恢复特性与良好的浪涌承受能力,便于在体积受限的 SMD 应用中替代传统快恢复二极管。
以上参数体现了 ES1D 在中等电流与高电压场合的实用性:较低的正向压降降低导通损耗,快速恢复时间适合高频开关环境,较小的反向漏电流有利于提高效率和降低待机功耗。
ES1D 所用 SMA(DO-214AC)封装适配表面贴装工艺,封装体积小、热阻适中。为保证长期可靠性与高电流能力,建议在 PCB 设计时:
若设计要求更低的正向压降或更高频率工作,可考虑肖特基二极管,但需权衡其较高的反向漏电流与较低的耐压能力。若系统强调高耐压且容许较慢恢复时间,可选用标准快恢复或普通整流器件。本型号适合在 200V 环境下要求 1A 连续整流且需快速恢复的场合。
ES1D 具有良好的浪涌承受能力(Ifsm 33A),适合短时突发冲击电流。使用时应注意:
总结:ES1D 是一款面向中等功率、需快速恢复与高耐压场合的可靠 SMD 整流二极管,适用于各类开关电源、充电器与通用整流保护电路。选择时建议结合实际工作频率、平均电流与散热条件进行合理匹配,以确保系统长期稳定运行。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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