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DIOTEC BC556B
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DIOTEC BC556B
- Type
- DIOTEC
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DIOTEC
- Electronic Component
- BC556B
- Electronic Component
- 1
- Package
- TO-92
- Electronic Component
- 1 PNP
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.311g
- Electronic Component
- 1
- Electronic Component
- BM0227699750
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- PNP
- Frequency(f T)
- 150MHz
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BC556B 产品概述
一、主要特点
BC556B 为 DIOTEC（德欧泰克）出品的 PNP 小信号晶体管，TO-92 封装，适用于通用放大与开关场合。器件具有较高的直流电流增益与良好的高频特性，同时漏电流低，适合中低功率、低噪声电路设计。
二、主要参数
- 晶体管类型：PNP
- 集电极电流 Ic：最大 100 mA
- 集-发击穿电压 Vceo：65 V
- 最大耗散功率 Pd：500 mW（标准测试条件）
- 直流电流增益 hFE：200（在 Ic = 2 mA，Vce = 5 V 条件下）
- 特征频率 fT：150 MHz
- 集电极截止电流 Icbo：15 nA（典型，低漏电）
- 集电极饱和电压 VCE(sat)：约 650 mV（饱和态下典型值）
- 射基极击穿电压 Vebo：5 V（注意反向保护）
- 工作温度范围：-55 °C ～ +150 °C
- 封装：TO-92，三引脚通孔安装
三、典型应用
- 低功耗音频前级与小信号放大器
- 模拟开关、驱动与缓冲电路
- 高频放大与射频前端（受限于小信号级）
- 电流源、镜像电路与偏置网络
- 便携式设备和工业控制中低电流开关
四、使用建议与注意事项
- 禁止将基极-发射极反向电压超过 Vebo = 5 V，以免损伤结结构。
- 集电极电流不应超过 100 mA，且在 TO-92 封装下耗散功率受限（500 mW），工作时应考虑散热与环境温度的降额。
- 在开关应用中建议使用基极限流电阻以控制基极电流并避免过驱动。
- 对高阻抗或精密放大电路，利用其低 Icbo（≈15 nA）特性可减少偏置漂移。
- 若用于较高功率或高温环境，应选用更大封装或外加散热措施。
五、封装与机械特性
TO-92 经典小型塑料封装，适合通孔安装，便于手工与自动化插件。封装占位小、热阻相对较高，适合中低功率场合。引脚排列依厂商略有差异，设计时请以厂方数据手册为准。
六、典型电路示例
- 共射放大器：用于电压增益与信号放大，得益于高 hFE 在小电流下的良好性能。
- 发射跟随器：用作缓冲输出，提供低输出阻抗驱动后级。
- 低噪声前置放大：在低电流偏置下可实现较低噪声性能，适合传感器接口。
七、总结与选型提示
BC556B 是一款性能均衡的 PNP 小信号晶体管，适用于需要较高电流增益、低漏电与一定频率响应的通用电路。选型时若需更高功率或更低饱和压，应考虑更大封装或功率晶体管；对封装引脚和最大耗散有严格要求时，请参考 DIOTEC 官方数据手册以获取完整规范与典型曲线。
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