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DIOTEC M4
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DIOTEC M4
- Type
- DIOTEC
- Minimum package
- 7500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DIOTEC
- Electronic Component
- M4
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.11g
- Electronic Component
- 1
- Electronic Component
- BM0227699733
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 5uA@400V
- (Vf)
- 1.1V@1A
- Electronic Component
- 50℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 7500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：DIOTEC 通用整流二极管 1A / 400V （SMA封装）
一、产品简介
本器件为 DIOTEC（德欧泰克）出品的通用整流二极管，采用 SMA（DO-214AC）封装，面向开关电源、适配器、家电驱动及通用整流场合。器件在 1A 工作电流下正向压降低（Vf=1.1V@1A），在高电压应用中具有良好的耐压与低漏泄特性。
二、主要电气参数
- 正向压降（Vf）：1.1V @ IF=1A
- 直流反向耐压（Vr）：400V
- 额定整流电流（IF）：1A（连续）
- 反向电流（IR）：≤5μA @ VR=400V
- 非重复峰值浪涌电流（IFSM）：30A（标准半波脉冲规格，典型 8.3ms）
- 结温范围（Tj）：-50℃ ～ +150℃
三、封装与热性能
SMA（DO-214AC）表面贴装封装，体积小、适合自动贴装与回流焊。该封装对热阻及散热路径有限，建议在设计时：
- 在PCB上增加热铜箔与散热通孔，扩大散热面积；
- 在高环境温度或高占空比条件下进行适当电流降额；
- 遵循厂家回流焊温度曲线，避免超温影响器件可靠性。
四、适用场景
- 开关电源次级整流与续流二极管；
- 电源适配器、充电器整流；
- 交流整流桥（单片或桥式使用）；
- 极性保护、反向保护与浪涌吸收场合；
- 通用电子产品中的低至中功率整流需求。
五、使用要点与典型电路
- 峰值浪涌电流（IFSM）表示短时冲击能力，非连续波形下安全余量有限，建议在存在高冲击条件时并联或选型更高Ifsm器件；
- 反向漏流随温度上升增加，长期在高温高压下运行需考虑漏流带来的功耗与发热；
- 典型连接：单个用于半波整流或作为桥式整流的单元，续流二极管并联负载以抑制感性回路的反向尖峰。
六、可靠性与储存
器件工作结温范围宽，适应严苛环境。存储与封装处理时应注意防潮、防静电；在长期储存后使用前建议回流前做烘烤以消除吸湿风险（遵循DIOTEC出厂湿气敏感等级说明）。
七、选型与替代参考
本型号适合对体积、自动装配与成本有要求的通用整流应用。若需更高耐压或更低正向压降，可参考同类器件或咨询厂商技术支持。常见替代器件示例：1N4004（同为1A/400V系列中的常见型号），但封装与热性能需按实际应用比对确认。
如需完整数据手册、回流焊曲线或器件封装尺寸图，请联系 DIOTEC 官方或供货渠道获取原厂资料以完成最终设计验证。
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