WMSIC Electronic Components

DIOTEC ZMY56

ModelZMY56
PackageDO-213AB
BrandDIOTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DIOTEC ZMY56
Type
DIOTEC
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DIOTEC
Electronic Component
ZMY56
Electronic Component
1
Package
DO-213AB
Electronic Component
Zener Diode
Electronic Component
0.11g
Electronic Component
1
(Zzt)
60Ω
Electronic Component
BM0227743795
Diode
1
Current(Ir)
1uA@>28V
Power Dissipation(Pd)
1.3W
Electronic Component
52V~60V
Electronic Component
50℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZMY56 稳压二极管产品概述

一、产品简介

ZMY56 为 DIOTEC(德欧泰克)出品的独立式稳压二极管,稳压范围为 52V ~ 60V,最大耗散功率 Pd = 1.3W,适用于需要中高压基准或稳压保护的电路。器件采用 DO-213AB 封装,适合常规通孔组装或夹持安装,工作结温范围宽 (-50℃ ~ +150℃),可在较恶劣环境中长期可靠工作。

二、主要技术参数

  • 类型:独立式稳压二极管(Zener/shunt regulator)
  • 稳压值范围:52 V ~ 60 V
  • 反向漏电流 Ir:1 µA(按厂方给定测试条件,示例 28 V 测试点)
  • 动态阻抗 Zzt:60 Ω(在规定测试电流下测得)
  • 最大耗散功率 Pd:1.3 W(按环境温度和散热条件)
  • 工作结温:-50 ℃ ~ +150 ℃
  • 品牌:DIOTEC(德欧泰克)
  • 封装:DO-213AB

三、性能特点

  • 稳压电压高,适合中高电压参考与保护应用;
  • 低漏电流,有利于在微功耗电路中保持稳定基准;
  • 动态阻抗适中,能在小至中等电流变化下维持良好稳压性能;
  • 宽温度范围与较高的结温极限,适应工业应用环境。

四、典型应用场景

  • 作为高压基准源或电压参考,用于模拟前端或测量电路;
  • 作为浪涌或过压保护元件,保护后续低压器件不受短时高压冲击;
  • 在开关电源辅助稳压、偏置电路中作为并联稳压元件;
  • 工业控制、通信、电源设备等需高压稳压及温度耐受场合。

五、使用与选型建议

  • 稳压二极管作为并联稳压(分流)元件使用时,应根据最大耗散功率计算工作电流:Pd ≈ (Vin − Vz) × Iz。确保在最不利工况下 Iz 不使 Pd 超过 1.3 W,并为环境温度上升做降额处理。
  • 选择偏置电阻时,R = (Vin − Vz) / Iz。举例:若 Vin=80V、Vz=56V、期望 Iz=10mA,则 R≈2.4kΩ;此时耗散 Pd≈(80−56)V×10mA=0.24W,处于安全区。
  • 动态阻抗 60 Ω 意味着在负载或电流变化时,稳压精度受影响,若要求更高精度应考虑在工作电流点降低 Zzt 或并联低温漂电阻/精密放大补偿。
  • 在高温环境下需按厂商热特性对 Pd 作线性降额,避免长期靠近最大功耗工作。

六、封装与热管理

DO-213AB 封装体积小、引脚易于安装,但散热能力有限。通用建议:

  • 保持器件与散热平面或散热片的良好热接触,尽量缩短导线长度以降低热阻;
  • 在高功耗或高环境温度场合增设散热器或改善通风条件;
  • 焊接和加工按制造商推荐的工艺进行,避免过度加热导致结温升高。

七、可靠性与注意事项

  • 遵循稳压器件的额定极限使用,不要在瞬态高压下超出额定电流或能量;
  • 对于需高精度、低噪声的参考场合,建议配合滤波与稳流电路;
  • 采购时注意核对批次与规格书测试条件,确认 Zzt、Ir 等参数的测试电流和温度条件,以便与系统设计指标一致。

如需进一步的电气特性曲线、测试条件或封装尺寸图,可依据 DIOTEC 的官方规格书获取更详细的器件资料。

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