WMSIC Electronic Components

DIOTEC BC337-25BK BC337

ModelBC337-25BK
PackageTO-92
BrandDIOTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DIOTEC BC337-25BK
Type
DIOTEC
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DIOTEC
Electronic Component
BC337-25BK
Electronic Component
1
Package
TO-92
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.214g
Electronic Component
1
Electronic Component
BM0226506932
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
100MHz
Power Dissipation(Pd)
625mW
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC337-25BK(DIOTEC)产品概述

一、产品简介

BC337-25BK 是 DIOTEC(德欧泰克)出品的一款通用型 NPN 晶体管,采用 TO-92 塑封封装,适合多种低功率开关与放大场合。器件在中等电流下具有良好的直流电流增益和高频响应,适合作为驱动级、前置放大和通用开关使用。

二、主要特性

  • 直流电流增益 hFE = 160(测量条件:Ic = 100mA, VCE = 1V),属中高增益等级。
  • 最大集电极电流 Ic = 800mA,能满足短时较大电流需求。
  • 集电极-射极击穿电压 Vceo = 45V,可在中等电压电路中可靠工作。
  • 特征频率 fT = 100MHz,具备良好的小信号高频性能。
  • 集电极截止电流 Icbo = 100nA,低漏电流利于提升静态性能。
  • 射基极击穿电压 Vebo = 5V。
  • 饱和压 VCE(sat) 典型约 700mV(与驱动电流和测试条件相关)。
  • 最大耗散功率 Pd = 625mW(TO-92 封装,需关注散热与环境温度)。
  • 工作结温范围 Tj = -55℃ ~ +150℃,适合工业级温度环境。

三、封装与机械信息

器件采用常见的 TO-92 三极管塑封形式,便于穿孔安装与手工焊接。具体引脚排列、引脚间距以及封装尺寸请以 DIOTEC 官方数据表为准,以确保装配与电路板布局无误。

四、典型应用场景

  • 低中电流开关:驱动继电器、光耦、指示 LED、步进/直流微电机的控制单元(注意散热)。
  • 信号放大:小信号前级放大、传感器信号调理、音频前端放大。
  • 通用驱动级:作为逻辑电平到功率器件之间的缓冲或驱动晶体管。
  • 高频小信号电路:利用其 100MHz 的 fT,可用于中低频率放大与混合信号处理。

五、使用建议与注意事项

  • 虽然最大 Ic 标称 800mA,但在 TO-92 封装下连续工作应受限于耗散功率(625mW)与结温,必要时采取散热或减小工作周期。
  • 饱和压与增益受基极驱动电流影响,设计时应根据目标 Ic 选择合适的基极限流和驱动能力,以保证开关性能和线性度。
  • 对于高温或长期运行环境,应参考温度漂移与功耗降额曲线,避免长期在极限参数附近工作。
  • 具体引脚定义、测试条件与极限评分请以厂家数据手册为准,选型时确认后缀(如 -25、BK)对应的增益分组与封装版本。

六、质量与选型建议

DIOTEC 提供的 BC337-25BK 面向工业与通用电子用途,具备宽温度范围与稳定的电气特性。若需替换或并联使用,建议匹配增益分组与封装散热条件;在要求更高功率或更低饱和压的场合,可考虑封装更大的功率器件或 MOSFET 方案。

如需进一步的电气特性曲线、封装图或推荐原理图,建议索取 DIOTEC 官方数据表与应用说明。

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