WMSIC Electronic Components

DIOTEC BZT52C15

ModelBZT52C15
PackageSOD-123F
BrandDIOTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DIOTEC BZT52C15
Type
DIOTEC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DIOTEC
Electronic Component
BZT52C15
Electronic Component
1
Package
SOD-123F
Electronic Component
Zener Diode
Electronic Component
±5%
Electronic Component
0.062g
Electronic Component
1
Electronic Component
BM0264582831
Diode
1
Current(Ir)
100nA
Power Dissipation(Pd)
500mW
Electronic Component
13.8V~15.6V
Electronic Component
50℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C15 — 15V ±5% 500mW SOD-123F 稳压二极管概述

一、产品简介

BZT52C15 为单只独立式15V稳压(齐纳)二极管,标称稳压值为15V,公差±5%。该器件由 DIOTEC(德欧泰克)生产,采用小型 SOD-123F 封装,2 引脚设计,适合表面贴装自动化工艺与紧凑电路板布局。典型订购形式为 T/R 卷带包装,便于批量贴装。

二、主要技术参数

  • 稳压值(标称):15V
  • 稳压值范围:13.8V ~ 15.6V(±5%)
  • 反向电流 Ir:100nA(在规定反向电压下的漏电)
  • 耗散功率 Pd:500mW(注意需参照散热条件与温度降额)
  • 工作结温范围:-50℃ ~ +150℃
  • 封装:SOD-123F,2 引脚,表面贴装
  • 数量:单只独立器件

三、核心特点

  • 高稳定性:15V ±5% 的稳压精度适合一般参考与保护用途。
  • 低漏电:100nA 的低反向电流有利于低功耗与待机电路。
  • 小型封装:SOD-123F 尺寸小、占板面积低,适合便携与空间受限应用。
  • 容易焊接:适配自动贴片与回流工艺,卷带包装利于产线效率。

四、典型应用场景

  • 电源基准与局部稳压(作并联稳压器使用)
  • 过压保护与钳位电路(保护输入端或敏感节点)
  • 模拟与数字电路的参考源(非高精度参考)
  • 低功耗或待机电路,利用低漏电特性减少静态损耗

五、设计与使用建议

  • 功耗与散热:标称 Pd=500mW 为封装在特定条件下的最大耗散,实际可用功率与 PCB 铜箔面积、环境温度密切相关。设计时应按温度降额规则处理,并避免长期在额定 Pd 下工作。
  • 工作电流:作为并联稳压器时须通过串联限流电阻来限定流经齐纳二极管的电流;计算时考虑最小稳压电流与最大允许电流(由 Pd 限定)。
  • 反向漏电:100nA 适合低漏电场景,但在极高阻抗电路中仍需评估影响。
  • 极性与封装识别:贴装前核对封装标识与电路板丝印,注意极性方向以免损坏器件或电路。
  • 环境与可靠性:在高温或连续高功耗场合采用降额措施,遵循厂家推荐的回流焊温度曲线与储运条件。

六、封装与可靠性提示

SOD-123F 提供良好机械稳定性与焊接一致性,但由于体积小,散热能力有限,建议在 PCB 设计时配合适量铜箔散热区域或热沉方式提高热流散效果。取样与批量采购时请参考 DIOTEC 的完整数据手册,验证关键参数与测试条件。

总结:BZT52C15(DIOTEC)以其 15V 稳压、低漏电与小封装特点,适用于需要空间受限与低功耗的稳压、钳位场合。合理的热设计与电流限制是保证长期可靠工作的关键。

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