WMSIC Electronic Components

DIOTEC EGL34D

ModelEGL34D
PackageDO-213AA
BrandDIOTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DIOTEC EGL34D
Type
DIOTEC
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DIOTEC
Electronic Component
EGL34D
Electronic Component
1
Package
DO-213AA
Electronic Component
Switch Diode
Electronic Component
0.062g
Electronic Component
1
Electronic Component
BM0227699758
Current
500mA
Diode
1
Current(Ir)
5uA@200V
(Vf)
1.25V@500mA
Electronic Component
50℃~+175℃
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EGL34D 产品概述

一、产品简介

EGL34D 是 DIOTEC(德欧泰克)推出的一款通用开关二极管,采用 DO-213AA 小型封装,针对中低功率高速整流与开关应用优化。该器件在 500mA 工作电流下具有较低的正向压降与快速恢复特性,适合开关电源、DC-DC 变换器、继电器/电感回路钳位以及极性保护等场景。

二、主要参数

  • 正向压降 (Vf):1.25V @ If = 500mA
  • 直流反向耐压 (Vr):200V
  • 整流电流(额定): 500mA(平均整流电流)
  • 反向漏电流 (Ir):≤5 μA @ Vr = 200V
  • 反向恢复时间 (Trr):50 ns(典型)
  • 非重复峰值浪涌电流 (Ifsm):10A
  • 工作结温范围:-50 ℃ ~ +175 ℃
  • 封装:DO-213AA

三、性能优势

  • 低正向压降(1.25V@500mA):在中等电流工况下降低导通损耗,减小发热与功率消耗。
  • 低反向漏电(≤5μA@200V):在高压或待机条件下,提升效率并减少待机损耗。
  • 快速恢复(Trr≈50ns):适合开关频率较高的电源与脉冲电路,降低反向恢复引起的电磁干扰与能量损耗。
  • 良好浪涌承受能力(Ifsm=10A):能承受开机或突发脉冲浪涌,提升系统鲁棒性。
  • 宽工作结温:适合工业温度范围的应用场景。

四、典型应用

  • 开关电源(SMPS)输入整流与续流二极管
  • DC-DC 转换器的同步或异步整流
  • 电机驱动、继电器与电感负载的回收/钳位二极管
  • 电池充放电保护、极性保护电路
  • 通信与工业电子设备中的高压开关场景

五、设计与使用注意事项

  • 功率散热:在 If = 500mA、Vf = 1.25V 时线性耗散约 0.625W,器件需通过合理 PCB 铜箔与散热设计将结温控制在安全范围内;建议在高温或连续工作下对整流电流进行降额设计。
  • 高频开关:Trr≈50ns 适合多数中高频场合,但在极高频(数 MHz)或极端 dv/dt 条件下,应评估开关损耗与 EMI,必要时配合 RC 缓冲或晶体管驱动优化。
  • 浪涌与冲击:Ifsm=10A 能承受短时浪涌,但应避免长时间超额峰值冲击;建议在电源开关或插拔场景中加入软启动或限流措施。
  • 焊接与可靠性:遵循制造商的焊接曲线与 IPC/JEDEC 推荐流程进行回流焊,避免超温或过度机械应力;储存与装配时注意防潮与静电防护。
  • 漏电管理:在高压应用中,即使 Ir 很小,长时间高压下的累积泄漏和爬电距离也需考虑 PCB 布局与绝缘设计。

六、选型与订购建议

EGL34D 适合需要 200V 级别耐压、500mA 连续整流且要求快速恢复与低漏电的通用场景。选型时请确认系统最大工作温度、频率及允许压降;样品与批量采购请向 DIOTEC 授权分销商咨询最新数据手册、封装详情与交期。若需更低正向压降或更高电流能力,则可参考肖特基或更大封装的整流器件。

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