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DIOTEC GL34A
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DIOTEC GL34A
- Type
- DIOTEC
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DIOTEC
- Electronic Component
- GL34A
- Electronic Component
- 1
- Package
- DO-213AA
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.09g
- Electronic Component
- 1
- Electronic Component
- BM0227699756
- Current
- 500mA
- Diode
- 1
- Current(Ir)
- 5uA
- Electronic Component
- 50℃~+175℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GL34A 产品概述
一、产品简介
GL34A 为 DIOTEC（德欧泰克）出品的一款 MiniMELF 结构整流二极管，封装为 DO-213AA（迷你圆柱玻璃/金属化封装）。该器件针对通用整流与低压降整流应用进行了优化，体积小、热稳定性好，适合工业及消费类电子设备中对体积与温升有严格要求的场合。
二、主要电气参数
- 直流反向耐压 (Vr)：50 V
- 正向压降 (Vf)：1.2 V @ If = 0.5 A（典型工作点）
- 平均整流电流：0.5 A（500 mA）
- 反向漏电流 (Ir)：约 5 µA（典型/最大值，具体测试条件请参见厂商数据表）
- 非重复峰值冲击电流 (Ifsm)：10 A（单次浪涌，非重复）
- 工作结温范围：-50 ℃ ~ +175 ℃
以上参数表明 GL34A 在中低功率整流场合具有较低的正向压降和很小的反向漏电，适合对效率和静态功耗敏感的应用。
三、封装与热机械特性
GL34A 采用 DO-213AA（MiniMELF）圆柱形封装，特点包括：
- 线性热路与较小的热阻，利于散热管理；
- 玻璃/金属化体结构，耐高温和高应力能力较强；
- 封装惯性较大，贴装时需注意防滚动，推荐使用专用吸取头或托盘送料，回流或波峰焊工艺需按厂家推荐温度曲线执行。
对于应力与散热要求较高的设计，建议在电路板布局中为该封装预留适当的散热垫和铜箔面积以降低结温。
四、典型应用场景
- 开关电源与整流模块中的二次侧或辅助整流；
- 反向保护与电源路径整流（如电池管理与充放电保护）；
- 低功率马达与驱动电路的自由轮二极管（需关注 Ifsm 与重复峰值要求）；
- 便携设备、仪表及工业控制中要求低漏电与低静态功耗的整流场合。
五、可靠性与使用注意事项
- Ifsm 为非重复峰值浪涌电流（10 A），在设计中不得作为长期或重复冲击使用；需按应用环境评估浪涌能量与脉冲宽度。
- 反向漏电随温度上升而增加，高温工作时需注意漏电对系统功耗的影响。
- 封装为 MiniMELF，安装时避免器件滚动与机械冲击，焊接工艺应符合厂商回流曲线与温度限值。
- 在高湿或腐蚀性环境，应考虑额外保护或涂覆以提升长期可靠性。
六、选型与替代建议
如需更高反向耐压或更低正向压降，可参考同系列或其他厂商的 MELF/DO-214 标准封装产品；若需求为更高持续电流，应选用更大封装或肖特基二极管（需权衡反向漏电与正向压降）。采购时请核对 DIOTEC 的完整数据表、包装类型（卷带/盘装）与温度–电流限制以确保满足具体应用要求。
总结：GL34A 以其 50 V 反向耐压、0.5 A 的整流能力、较低正向压降与小漏电优势，适合对体积、效率及热性能有要求的中低功率整流应用。更多参数细节与封装信息请参考 DIOTEC 官方数据表。
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