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DIOTEC B250S-SLIM B250S
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DIOTEC B250S-SLIM
- Type
- DIOTEC
- Minimum package
- 1500
Technical parameters
- Electronic Component
- DIOTEC
- Electronic Component
- B250S-SLIM
- Electronic Component
- 1
- Package
- SO-DIL
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.593g
- Electronic Component
- 1
- Electronic Component
- BM0228685091
- Current
- 1A
- Current(Ir)
- 5uA@600V
- (Vf)
- 1.1V@1A
- Electronic Component
- 50℃~+150℃
- Electronic Component
- 1500
- Voltage Rating (Vr)
- 600V
- Surge Current (Ifsm)
- 50A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
B250S-SLIM 产品概述
一、产品简介
B250S-SLIM 是 DIOTEC（德欧泰克）推出的一款单相整流桥，针对一般交流-直流整流场合设计。器件在 1A 工作电流下正向压降典型为 1.1V，直流反向耐压高达 600V，静态反向电流仅 5µA（600V），并具备 50A 的非重复峰值浪涌能力，结温工作范围宽 (-50℃ ~ +150℃)，适合多种工业与消费类电源应用。
二、主要特性
- 额定整流电流：1A（持续工作）
- 直流反向耐压：600V（Vr）
- 正向压降：1.1V @ 1A（Vf，典型值）
- 反向漏电流：5µA @ 600V（Ir，典型值）
- 非重复峰值浪涌电流：50A（Ifsm，单次浪涌，具体波形与时长请参考规格书）
- 工作结温：-50℃ 至 +150℃
- 类型：单相整流桥（四二极管集成）
- 封装：SO-DIL 纤薄封装，节省面板空间
三、应用场景
适用于小功率开关电源、适配器、充电器、家电控制板、灯具驱动和一般交流到直流整流电路。封装紧凑、耐压高且漏电小，尤其适合对耐压与静态功耗有要求的设计。
四、设计与可靠性要点
- 温升管理：1A 连续工作时应考虑 PCB 铜箔散热与通孔散热，必要时采用较大铜面或散热片以降低结温并延长寿命。
- 浪涌规范：50A 为非重复峰值浪涌能力，遇到高能浪涌或反复冲击需评估浪涌保护（限流器、NTC、MOV 等）。
- 反向电流：高耐压下的 5µA 漏电流适合对静态功耗敏感的电源，但在高温下漏电会增加，设计时按最差工况考虑。
- 引脚与封装：SO-DIL 纤薄封装便于密集布局，装配时注意焊接热量与机械应力，确保可靠接触。
五、封装与管脚
SO-DIL 封装内置整流桥四颗二极管，典型管脚为两个交流输入（~）和正、负输出（+、-）。具体引脚排列与尺寸请以厂家数据手册为准，便于布局与孔位配合。
六、小结
B250S-SLIM 以其 600V 高耐压、低漏电、纤薄封装与良好的浪涌能力，适合常见小功率整流需求。选型时请结合实际工作温度、散热条件与浪涌环境，并参考 DIOTEC 的完整规格书以获得详细电气和机械参数。
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