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DIOTEC BY1600
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DIOTEC BY1600
- Type
- DIOTEC
- Minimum package
- 1700 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DIOTEC
- Electronic Component
- BY1600
- Electronic Component
- 1
- Package
- DO-201
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.86g
- Electronic Component
- 1
- Electronic Component
- BM0227699735
- Current
- 3A
- Diode
- 1
- Current(Ir)
- [email protected]
- (Vf)
- 1.1V@3A
- Electronic Component
- 50℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 1700
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BY1600 产品概述
一、产品简介
BY1600 是 DIOTEC（德欧泰克）推出的一款通用高压整流二极管，采用 DO-201 轴向封装，面向需要高反向耐压与较大整流能力的电源与脉冲应用。该器件在高压条件下具有低反向漏电与良好的浪涌承受能力，适合在苛刻的高压环境中长期稳定工作。
二、主要特性
- 正向压降 (Vf)：1.1 V @ If = 3 A
- 直流反向耐压 (Vr)：1600 V
- 直流整流电流：3 A（连续）
- 反向电流 (Ir)：5 μA @ Vr = 1600 V
- 非重复峰值浪涌电流 (Ifsm)：110 A
- 工作结温范围：-50 ℃ ~ +150 ℃
- 品牌：DIOTEC（德欧泰克）
- 封装：DO-201（轴向引线）
三、典型电气性能说明
BY1600 在 3 A 工作电流下的典型正向压降约为 1.1 V，表现出较低的导通损耗；在 1600 V 的反向电压下，漏电流仅为微安量级（5 μA），适合高压整流、倍压器等对漏电要求严格的场合。110 A 的峰值浪涌能力能够承受短时过载或启动冲击，提升系统的鲁棒性。
四、封装与机械特性
DO-201 为轴向引线封装，机械强度高、便于手工焊接或波峰焊接（具体焊接条件请参照封装热时限说明）。轴向结构便于在通过孔板和点对点连线的电路中使用，且有利于散热和绝缘距离的设计。
五、典型应用
- 高压整流电源与倍压器
- 脉冲电源与耦合电路
- 工业高压供电（静电、离子发生器等）
- 医疗与分析设备的高压电源（依据器件适配性与系统认证）
- 需要高耐压与中等整流电流的通用电源模块
六、热管理与使用注意
- 在长期连续工作下，应考虑结温与环境温度对最大允许电流的降额；建议在设计时留有余量并优化散热路径。
- 反向漏电随温度上升而增加，高温环境下应评估漏电对电路的影响。
- 高压应用需注意端子与周围导体间的爬电与空气间隙，保证足够的绝缘距离与防护。
- 焊接时遵循 DO-201 封装的热循环限制，避免长时间高温焊接造成封装损伤。
七、选型建议与结语
选择 BY1600 时，应结合实际工作电压、峰值电流和散热条件评估其可靠性。对于要求更低反向漏电或更高正向电流的场合，可参考 DIOTEC 系列中其他型号以匹配具体需求。总体而言，BY1600 以其 1.6 kV 的高耐压与良好的浪涌能力，适合作为工业与高压电源设计中的可靠整流元件。
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