Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
EVERLIGHT EL852S(TA) EL852S
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- EVERLIGHT EL852S(TA)
- Type
- EVERLIGHT
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- EVERLIGHT
- Electronic Component
- EL852S(TA)
- Electronic Component
- 1
- Package
- SMD-4P
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0.61g
- Electronic Component
- 1
- Electronic Component
- BM0226962749
- Operating Temperature
- 55℃~+100℃
- Load Voltage
- 350V
- Output Current
- 5.8mA
- Output Type
- Photoelectric Transistor
- Output Channel Count
- 1
- (Vf)
- 1.2V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EL852S(TA) 产品概述
一、产品简介
EL852S(TA) 是台湾亿光（EVERLIGHT）出品的一款光电三极管隔离器（Coupler），采用 SMD-4P 表面贴装封装，提供单通道光电耦合功能。器件内部由红外发光二极管与光电三极管组成，能实现输入与输出之间的电气隔离与信号传输，适用于需要高电压绝缘和信号隔离的电路场合。
二、主要参数
- 输出类型：光电三极管
- 隔离电压 (Vrms)：5 kV
- 工作温度范围：-55 ℃ ～ +100 ℃
- 电流传输比 (CTR)：最小值 1000%，饱和值/最大值可达 15000%
- 正向压降 (Vf)：1.2 V
- 输出电流：5.8 mA
- 直流反向耐压 (Vr)：9 V
- 负载电压：350 V
- 输出通道数：1
- 集-射极饱和电压 VCE(sat)：1.2 V @20 mA, 100 mA
三、特性与优势
- 高隔离强度：5 kV RMS 隔离能力，满足工控、通信与电源等领域对安全隔离的要求。
- 宽温度范围：-55 ℃ 至 +100 ℃，适应工业级环境和高温工况。
- 高 CTR 范围：CTR 最小 1000%，在低驱动电流下亦能获得较高的输出响应；在特定条件下可达到较高饱和值（15000%），便于低功耗设计。
- 小体积 SMD 封装：SMD-4P 便于表面贴装自动化生产，提高组装效率与可靠性。
- 高压承受能力：输出端可耐受高达 350 V 负载电压，适合高电压信号隔离场景。
四、典型应用
- 开关电源和电源管理隔离信号传输
- 微控制器与高压电路之间的逻辑隔离
- 工业控制、PLC 与传感器信号隔离
- 电表、安防设备与家电控制电路中的保护隔离
五、封装与焊接建议
SMD-4P 表面贴装封装适合回流焊工艺。建议在 PCB 设计时保留足够爬电距离与阴影区，以维持隔离性能。焊接时遵循厂商推荐的回流温度曲线与预热条件，避免长时间高温导致器件性能退化。
六、使用注意事项
- CTR 受温度与驱动电流影响较大，实际设计应参考器件在对应 If、Ic 条件下的典型曲线并留有裕量。
- 输出端在高电压应用中需注意散热与绝缘距离，避免击穿与漏电。
- 存储与焊接过程中避免潮湿与静电损伤，必要时采取干燥柜与防静电措施。
EL852S(TA) 凭借高隔离电压、宽工作温度和 SMD 封装特点，是要求可靠隔离与紧凑封装设计的理想选择。如需更详细的电气特性曲线与典型应用电路，建议参考厂商数据手册或联系供应商获取原厂资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
