WMSIC Electronic Components

EVERLIGHT EL1013(TA)-VG EL1013

ModelEL1013(TA)-VG
PackageSOP-4-2.54mm
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EVERLIGHT EL1013(TA)-VG
Type
EVERLIGHT
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EVERLIGHT
Electronic Component
EL1013(TA)-VG
Electronic Component
1
Package
SOP-4-2.54mm
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.276g
Electronic Component
1
Electronic Component
3us
Electronic Component
BM0128480497
Operating Temperature
55℃~+110℃
Load Voltage
80V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
(Pd)
250mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:EL1013(TA)-VG 晶体管输出光耦

EL1013(TA)-VG 是一款由台湾亿光(EVERLIGHT)制造的高性能光耦合器,其设计旨在满足多种电子应用中的信号隔离和传递需求。这款光耦具有单通道工作,能够实现高达5000Vrms的电压隔离,从而有效保护控制电路免受高电压干扰。

基本参数

EL1013(TA)-VG 的规格参数定义了其在实际应用中的重要性能。该光耦具备以下特点:

  • 通道数:1
  • 电压隔离:5000Vrms,确保了高可靠性的电气隔离。
  • 电流传输比:最小值为100% @ 10mA,最大值可达200% @ 10mA,为设计人员在不同负载下提供灵活性。
  • 接通/关断时间:典型的接通时间为4µs,关断时间为3µs,适合快速信号传递的应用场景。
  • 上升/下降时间:典型值为2µs和3µs,确保信号稳定传输。

输出与输入特性

输出方面,EL1013(TA)-VG 采用晶体管输出类型,具有以下关键特性:

  • 输出电压最大值:80V,适用于多种高压环境。
  • 输出电流:单通道输出电流可达50mA,满足多数应用的需求。
  • 输入类型:支持DC输入,便于与多种控制电路配合使用。

输入的正向电压(Vf)为典型的1.45V,而DC 正向电流(If)的最大值为60mA,这为复杂电路设计提供了良好的兼容性。

电气性能

EL1013(TA)-VG 在电气性能方面表现优异,其 Vce 饱和压降最大为300mV,保证了电路工作时的高效率。宽广的工作温度范围 (-55°C ~ 110°C) 使其在各种恶劣环境中依然能够稳定工作,极大提升了应用灵活性。

封装与安装

该光耦采用表面贴装型(SMD)设计,封装形式为4-SOP(2.54mm),方便与现代PCB设计相结合。其紧凑的封装设计使得在空间有限的电路板上也能轻松实现高效布局。

应用场景

EL1013(TA)-VG 光耦合器广泛用于工业自动化、数据通信和电力系统等领域,特别适用于需要基础信号隔离的控制和监控应用。对于要求高电压隔离与低功耗设计的电路,EL1013(TA)-VG 是一个理想选择。

综合优势

EL1013(TA)-VG 的类型和设计使其成为一款高度可靠的光耦合器,具有快速响应时间高、电压隔离及适中的功耗等优点。这种特性充分满足了现代电子设备对信号传递的高性能要求,为工程师在设计复杂系统时提供了一个稳健的解决方案。

总体而言,EL1013(TA)-VG 是一款集高效能与可靠性于一身的光耦产品,适合在各种应用中实现电气隔离与信号传递。选择 EL1013(TA)-VG,将为电路设计带来一系列的优势,确保稳定性和优异的性能表现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.