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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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25-21SYGC/S530-E2/TR8 是由台湾亿光电子股份有限公司(Everlight Electronics Co Ltd)制造的一款表面贴装型LED(Light Emitting Diode),适用于各种电子设备中的指示灯、背光、装饰灯等应用。以下是对此产品的详细介绍。
25-21SYGC/S530-E2/TR8 LED具有24mcd的高亮度,这使得它在各种应用场景中都能提供清晰可见的指示灯效果。其典型正向电压为2V,测试电流为20mA,确保了在正常工作条件下能耗低且效能高。
此LED具有60°的宽视角,这意味着它可以在较大的范围内提供均匀的发光效果,无论从哪个角度观察,都能保持良好的可视性。
采用1206(3216 公制)封装,尺寸为3.20mm长 x 1.60mm宽 x 1.10mm高,使其非常适合于紧凑的电子设备设计。表面贴装型设计简化了生产过程,提高了生产效率。
无色透明透镜设计不仅提高了光学性能,还增强了产品的耐用性和抗环境影响的能力。这种设计确保了在各种环境条件下,LED都能保持稳定的性能。
由于其高亮度和宽视角,25-21SYGC/S530-E2/TR8非常适合用于电子设备中的指示灯,如电源指示、工作状态显示等。
其黄绿色光谱使其成为背光和装饰灯的理想选择,可以为产品添加独特的视觉效果。
在仪表盘和控制面板中,使用此LED可以提供清晰明显的指示信号,提高操作员的工作效率。
此LED也广泛应用于消费电子产品,如手机、平板电脑、智能家居设备等,用于各种指示和显示功能。
在安装过程中,需要遵循适当的焊接温度和时间,以避免损害LED。通常推荐使用无铅焊料,并确保焊接温度不超过260°C。
确保正确连接LED的正负极,以避免反向电压导致的损坏。推荐使用适当的电阻来限制电流,防止过载。
在使用过程中,应避免将LED暴露在高温、高湿度或强烈振动的环境中,以确保其长期稳定运行。
25-21SYGC/S530-E2/TR8 是一款高性能、多功能的表面贴装型LED,适用于广泛的电子设备应用。其高亮度、宽视角、低能耗以及小尺寸设计,使其成为现代电子产品设计中的理想选择。通过遵循适当的安装和使用注意事项,可以最大限度地发挥出此LED的性能优势。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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