WMSIC Electronic Components

EVERLIGHT 17-215/BHC-AP1Q2/4T 17-215

Model17-215/BHC-AP1Q2/4T
Package0805
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EVERLIGHT 17-215 / BHC-AP1Q2 / 4T
Type
EVERLIGHT
Minimum package
4000

Technical parameters

Power
75mW
Electronic Component
EVERLIGHT
Electronic Component
17-215/BHC-AP1Q2/4T
Electronic Component
1
Package
0805
Electronic Component
LEDDiode / LED
Electronic Component
0.019g
Electronic Component
1
LED
130°
LED
Electronic Component
Electronic Component
BM0264380193
Electronic Component
468nm
Operating Temperature
40℃~+85℃
Current
20mA
Electronic Component
Electronic Component
Diode
Diode

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

17-215/BHC-AP1Q2/4T(0805)产品概述

一、产品简介

17-215/BHC-AP1Q2/4T 是 EVERLIGHT(台湾亿光)系列的一款蓝光表面贴片发光二极管,标称为0805尺寸。该器件为独立二极管、无色透明透镜,峰值波长468 nm,适用于需要清晰蓝色指示与宽视角的各种照明与指示应用。

二、主要性能参数

  • 发光颜色:蓝色
  • 峰值波长:468 nm(典型)
  • 正向压降(Vf):3.3 V(典型)
  • 正向电流(If):20 mA(额定)
  • 功率:75 mW(额定最大),典型耗散 Vf×If ≈ 3.3V×20mA = 66 mW
  • 发光角度:130°(宽视角)
  • 透镜:无色透明(光学纯净、指示清晰)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 二极管配置:独立二极管(单体发光)

三、结构与封装说明

型号后缀表明为0805系列表面贴装芯片,典型外形约为2.0 × 1.25 mm(标称0805)。透明透镜与发光芯片一体化封装,适合自动贴装与回流焊工艺。具体外形尺寸、焊盘建议与吸湿等级请以厂家数据手册为准。

四、典型应用场景

  • 指示灯与面板指示(设备状态、报警等)
  • 背光与按键指示(消费电子、仪表)
  • 工业控制指示及信号显示
  • 小型显示模块与视觉提示系统

五、使用建议与注意事项

  • 电流限制:建议使用恒流驱动或串联限流电阻,避免长时间满额定电流工作以延长寿命;若要求更长寿命或更低热量,推荐10–15 mA 驱动或适当降额。
  • 功率管理:器件额定功率75 mW,典型运行时消耗约66 mW,建议在设计时留有热余量并做好散热铜皮布线。
  • ESD与反向电压保护:LED 对静电敏感,建议在装配与测试环节采取ESD防护;电路中可加入反向并联二极管以防反向击穿。
  • 环境温度:在高温环境下注意对正向电流做温度降额(derating),以防光衰与寿命降低。

六、焊接与储存建议

  • 推荐按行业回流焊规范(如 J-STD-020)进行焊接,参考厂方回流曲线。
  • 存储应避光、低湿、防静电;若为干燥箱出厂,开封后按吸湿等级(MSL)要求在规定时间内贴片并回流。
  • 焊后避免反复加热、长时间高温暴露,以免加速光衰或封装变色。

七、品质验证与选型提示

在批量使用前建议进行下列验证:光输出(cd或lm)与色坐标确认、在目标电流和温度下的老化测试、焊接兼容性实验以及PCB热仿真。若对尺寸公差或焊盘形状有严格要求,应索取并确认厂方的详细机械规格书(Mechanical Drawing)与回流曲线。

总结:17-215/BHC-AP1Q2/4T(0805)为一款视角宽、色纯澈的蓝光SMD LED,适合常规指示与小型照明场合。为保证可靠性与性能,建议按厂方资料及行业规范进行驱动、焊接与热管理设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.