WMSIC Electronic Components

EVERLIGHT H11L1

ModelH11L1
PackageDIP-6
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
EVERLIGHT H11L1
Type
EVERLIGHT
Unit
Electronic Component
Minimum package
1625 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
EVERLIGHT
Electronic Component
H11L1
Electronic Component
1
Package
DIP-6
Electronic Component
Logic Output Optocoupler
Electronic Component
0.78g
Electronic Component
1
Channel Count
1
Electronic Component
1Mbit/s
Features
Built-in Flip-Flop
Electronic Component
BM0220159645
Operating Temperature
55℃~+100℃
Operating Voltage
3V~15V
Type
DC

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

H11L1 产品概述

引言

H11L1 是一款高性能的逻辑输出光耦合器,广泛应用于需要电气隔离和信号传输的电子电路中。该器件由台湾亿光(EVERLIGHT)公司生产,符合工业自动化、通信设备及其他各类电子系统的要求。凭借其优异的性能参数,H11L1成为设计师和工程师在开发电子产品时的理想选择。

基础参数

H11L1 光耦的主要特点包括以下几个方面:

  1. 通道数:该光耦具有单通道设计,适合简单的信号传输应用。

  2. 输入类型:支持直流(DC)输入,便于与各类电源和控制电路兼容。

  3. 输出类型:开路集电极输出,这一特性使得在输出端对下游电路的连接更加灵活,尤其是在多种负载情况下。

  4. 电压隔离:具备高达5000Vrms的电压隔离能力,确保在高电压环境下安全操作,防止干扰和损坏。

  5. 输出电流:每通道最大输出电流为50mA,适于驱动小功率负载,确保设备在稳定条件下运行。

  6. 数据速率:具有高达1MHz的数据传输速率,适合快速信号处理和高频应用。

  7. 传播延迟:最大传播延迟(tpLH和tpHL均为4µs),使得其在传递快速开关信号时表现优异。

  8. 上升/下降时间:典型上升和下降时间为100ns,这为高速数据传输提供了保障。

  9. 正向电压和电流:其正向电压在1.15V左右,允许的最大直流正向电流为60mA,这为光耦的驱动提供了清晰的参数界限。

  10. 供电电压:运行电压范围从3V到16V,使得H11L1能在多种工作环境中使用,灵活适应不同的电源设计。

  11. 工作温度:广泛的工作温度范围(-55°C ~ 100°C)确保了在极端条件下的稳定性与可靠性。

  12. 封装形式:采用6-DIP(0.300",7.62mm)封装,便于通孔焊接,适配各种PCB设计。

应用场景

由于其良好的电气特性和结构,H11L1 光耦被应用于多个领域,包括:

  • 工业自动化:用于传感器信号的隔离与处理,保护主控制器免受高电压和噪声的干扰。

  • 通信设备:在信号发送和接收端提供隔离,提高通信性能和安全性。

  • 消费电子:如智能家居产品中,用于数据采集和控制信号传导,实现稳定的电子控制。

  • 电源管理:通过电气隔离增强电源的稳定性,对电源进行有效保护。

  • 医疗设备:其中电气隔离是安全和可靠性的重要因素,H11L1能有效避免病人设备与电源之间的直接连接风险。

总结

综合以上特点,H11L1 逻辑输出光耦是一款具有高性能和广泛应用领域的电子元器件。它不仅满足了现代电子产品日益增长的性能需求,还提供了高电压隔离和卓越的速度,适用于各种严苛的工作环境。无论是工业自动化,还是消费电子产品的应用,H11L1 都为设计师提供了一个可靠的解决方案,为各种电子项目的成功实施奠定了坚实的基础。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.