WMSIC Electronic Components

EVERLIGHT 12-22/BHR6C-A01/2C 12-22

Model12-22/BHR6C-A01/2C
PackageSMD-3P,3x2mm
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EVERLIGHT 12-22 / BHR6C-A01 / 2C
Type
EVERLIGHT
Minimum package
2000

Technical parameters

Power
60mW;110mW
Electronic Component
EVERLIGHT
Electronic Component
12-22/BHR6C-A01/2C
Electronic Component
1
Package
SMD-3P,3x2mm
Electronic Component
470nm;624nm
Electronic Component
LEDDiode / LED
Electronic Component
0.044g
Electronic Component
1
LED
90mcd~135mcd;72mcd~100mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0231071455
Electronic Component
632nm;468nm
Operating Temperature
40℃~+85℃
Current
20mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EVERLIGHT 12-22/BHR6C-A01/2C 发光二极管产品概述

一、产品简介

12-22/BHR6C-A01/2C 是台湾 EVERLIGHT(亿光)出的 SMD 发光二极管,属于小型三脚封装(SMD-3P,尺寸 3×2 mm)。该型号为共阳极(Common Anode)二极管,内含两色发光单元:橙红色与蓝色,配以透明无色透镜,提供宽广的出光角度(120°),适用于各类面板指示、信号显示与背光应用。器件设计支持工业级工作温度范围(-40℃ 到 +85℃),适配自动化贴片与回流焊装配流程。

二、主要参数概览

  • 品牌:EVERLIGHT(台湾亿光)
  • 型号:12-22/BHR6C-A01/2C
  • 封装:SMD-3P,外形尺寸约 3 × 2 mm
  • 发光颜色:橙红色、蓝色(双色封装)
  • 波长 / 峰值:蓝色约 468–470 nm;橙红色约 624–632 nm
  • 光功率:60 mW、110 mW(型号/档位依具体配置)
  • 额定正向电流:20 mA(单色驱动)
  • 二极管配置:共阳极(Common Anode,便于共用正极电源)
  • 透镜:无色透明,光学扩散小,保留较高亮度
  • 发光角度:120°(宽视角)
  • 载带方式:侧贴(贴片带方向为侧向封装摆放,便于贴装机取放)
  • 工作温度:-40℃ ~ +85℃

三、封装与引脚说明

该器件为三引脚 SMD 封装,通常分布为一个共阳极引脚与两个独立的阴极引脚(对应蓝、橙红两色)。共阳极结构在需要共用正电源或简化驱动线路时非常方便,尤其适合使用单一电源并对各色进行低侧开关控制的场合。3×2 mm 的小尺寸有利于高密度 PCB 布局与紧凑型产品设计。

四、光学与电气特性要点

  • 宽视角(120°)设计使光线分布均匀,适合指示灯或背光而非高集光照明。
  • 典型驱动电流为 20 mA,应通过限流电阻或恒流驱动器控制,以保证稳定亮度与延长寿命。
  • 橙红和蓝色的峰值波长分别位于视觉和指示常用范围,可提供醒目的颜色对比,便于状态辨识。
  • 光功率提供 60 mW 与 110 mW 等不同档位,设计时应根据亮度需求与热量预算选择合适规格。

(注:更详细的正向电压 Vf、反向电压 Vr、最大功耗与光强等参数建议参阅厂方完整 Datasheet,以便准确进行电气设计及热设计评估。)

五、典型应用场景

  • 仪器仪表面板、状态指示灯(双色指示同一位置不同状态)
  • 消费电子与工业控制面板的指示与通知灯
  • 机箱、设备的局部背光与标识照明
  • IoT 设备、路由器、安防与通讯设备的状态显示
  • 需要宽视角且颜色对比明显的场合

六、PCB 布局与装配建议

  • 根据包装的“侧贴”载带方向,安排贴片机取放时的元件方向,避免送料错误。
  • 留足焊盘与丝印标识,便于贴装和维修;遵循 EVERLIGHT 的推荐 Land Pattern 以保证焊接可靠性。
  • 回流焊时严格遵循亿光推荐的回流温度曲线与时间参数,避免过度加热导致光衰或封装变形。
  • 使用限流电路或恒流驱动器控制正向电流,避免超过 20 mA 的长期驱动,以延长可靠度。
  • 若在高亮度(高功率档)配置下工作,应评估 PCB 热阻并适当做散热设计。

七、可靠性与注意事项

  • 避免反向电压长时间施加,应在电路中加入保护元件(如反向保护二极管或限压措施)。
  • 在自动化清洗或强振动环境中,注意焊点质量与元件固定。
  • ESD 敏感,贴装与测试过程中应采取静电防护措施。
  • 长期在极端高温下工作会加速光衰,设计时注意热管理与使用寿命评估。

八、采购与替代建议

对于工程样机或量产,建议向 EVERLIGHT 官方或其授权分销商获取原厂 Datasheet、BOM 推荐项与批次光色分选(binning)信息。若需替代,可查找同尺寸 SMD-3P、共阳极双色 LED 的同类产品,但在替换前务必比对电气参数(Vf、If、光功率、视角)与封装机械尺寸以确保兼容。

如需我帮忙查找该型号的完整 Datasheet、封装图或推荐 PCB landpattern,我可以继续提供更详细的支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.